يعرض 1 - 10 نتائج من 44 نتيجة بحث عن '"Ong, Jia-Juen"', وقت الاستعلام: 1.04s تنقيح النتائج
  1. 1
    مؤتمر
    Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hydrophilicity Enhancement with NaOH for Chip-to-wafer Bonding

    المؤلفون: Chen, Yu-An, Ong, Jia-Juen, Chiu, Wei-Lan, Hsu, Wei-You, Yang, Shih-Chi, Chang, Hsiang-Hung, Chen, Chih

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :399-403 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Low-Temperature Cu-Cu Bonding Using -oriented and Nanocrystalline Hybrid Surface Grains

    المؤلفون: Li, Chen-Ning, Ong, Jia-Juen, Chiu, Wei-Lan, Yang, Shih-Chi, Chang, Hsiang-Hung, Chen, Chih

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1312-1316 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Surface Modification by Wet Treatment for Low-Temperature Cu/SiO2 Hybrid Bonding

    المؤلفون: Chen, Yu-An, Ong, Jia-Juen, Chiu, Wei-Lan, Chang, Hsiang-Hung, Chen, Chih

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :115-116 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  4. 4
    مؤتمر
    Surface modification on hydrophilicity enhancement using NH4OH, NaOH, and KOH on fine-pitch low-temperature Cu/SiO2 Hybrid Bonding

    المؤلفون: Ong, Jia-Juen, Tran, Dinh-Phuc, Chiu, Wei-Lan, Chen, Yu-An, Lee, Ou-Hsiang, Chang, Hsiang-Hung, Chen, Chih

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1549-1552 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Low Thermal Budget Cu/SiO2 Hybrid Bonding Using Highly -oriented Nano-twinned Cu with Low Contact Resistivity and High Bonding Strength

    المؤلفون: Ong, Jia-Juen, Tran, Dinh-Phuc, Hsun, Yu-Min, Chiu, Wei-Lan, Lee, Ou-Hsiang, Chang, Hsiang-Hung, Chen, Chih

    المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

    Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  6. 6
    مؤتمر
    Fabrication and Reliability Analysis of Quasi-single Crystalline Cu Joints Using Highly -oriented Nanotwinned Cu

    المؤلفون: Ong, Jia-Juen, Tran, Dinh-Phuc, Lin, You-Yi, Hsu, Po-Ning, Chen, Chih

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1206-1210 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Reliability Enhancement of Cu-Cu joints by Two-step Bonding Process

    المؤلفون: Ong, Jia-Juen, Tran, Dinh-Phuc, Hsu, Po-Ning, Shie, Kai-Cheng, Chen, Chih

    المصدر: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2021 16th International. :78-81 Dec, 2021

    Relation: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  8. 8
    مؤتمر
    Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2 Hybrid Bonding

    المؤلفون: Yang, Shih-Chi, Ong., Jia-Juen, Tran, Dinh-Phuc, Chiu, Wei-Lan, Lee, Ou-Hsing, Chiang, Chia-Wen, Chang, Hsiang-Hung, Wang, Chin-Hung, Chen, Chih

    المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :13-14 Apr, 2023

    Relation: 2023 International Conference on Electronics Packaging (ICEP)

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  9. 9
    مؤتمر
    Fine-pitch -oriented NT-Cu/SiO2 hybrid joints with high thermal fatigue resistance and low contact resistivity

    المؤلفون: Ong, Jia-Juen, Chiu, Wei-Lan, Chang, Hsiang-Hung, Tran, Dinh-Phuc, Chen, Chih

    المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :15-16 Apr, 2023

    Relation: 2023 International Conference on Electronics Packaging (ICEP)

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  10. 10
    مؤتمر
    Two-step fabrication process for die-to-die and die-to-wafer Cu-Cu bonds

    المؤلفون: Ong, Jia Juen, Shie, Kai-Cheng, Tu, King-Ning, Chen, Chih

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :203-210 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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