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1دورية أكاديمية
المؤلفون: Tanaka, K., Kojima, H., Onoda, M., Suzuki, K.
المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 22(2):1118-1123 Apr, 2015
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2مؤتمر
المؤلفون: Kiyoyama, K., Onoda, M., Tanaka, Y.
المصدر: 2005 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and systems Circuits and Systems (ISCAS), 2005 IEEE International Symposium on. :1940-1943 Vol. 3 2005
Relation: 2005 IEEE International Symposium on Circuits and Systems (ISCAS)
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3مؤتمر
المصدر: IEEE International Conference on Dielectric Liquids, 2005. ICDL 2005. Dielectric liquids Dielectric Liquids, 2005. ICDL 2005. 2005 IEEE International Conference on. :441-444 2005
Relation: 2005 IEEE International Conference on Dielectric Liquids
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4مؤتمر
المصدر: Proceedings of 2005 International Symposium on Electrical Insulating Materials, 2005. (ISEIM 2005). Electrical insulating materials Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on. 1:195-198 Vol. 1 2005
Relation: Proceedings of 2005 International Symposium on Electrical Insulating Materials (ISEIM 2005)
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5مؤتمر
المؤلفون: Morooka, H., Takezawa, Y., Onoda, M., Kamiya, H.
المصدر: Proceedings of the 7th International Conference on Properties and Applications of Dielectric Materials (Cat. No.03CH37417) Properties and applications of dielectric materials Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on. 3:1076-1079 vol.3 2003
Relation: IEEE 7th International Conference on Properties and Applications of Dielectric Materials
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6مؤتمر
المصدر: Proceedings of the 7th International Conference on Properties and Applications of Dielectric Materials (Cat. No.03CH37417) Properties and applications of dielectric materials Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on. 2:782-785 vol.2 2003
Relation: IEEE 7th International Conference on Properties and Applications of Dielectric Materials
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7مؤتمر
المؤلفون: Kobayashi, F., Fukui, T., Arai, F., Fukuda, T., Kojima, F., Onoda, M., Hotta, Y.
المصدر: 2002 IEEE World Congress on Computational Intelligence. 2002 IEEE International Conference on Fuzzy Systems. FUZZ-IEEE'02. Proceedings (Cat. No.02CH37291) Fuzzy systems - FUZZ-IEEE'02 Fuzzy Systems, 2002. FUZZ-IEEE'02. Proceedings of the 2002 IEEE International Conference on. 2:1482-1487 vol.2 2002
Relation: 2002 IEEE World Congress on Computational Intelligence. 2002 IEEE International Conference on Fuzzy Systems. FUZZ-IEEE'02
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8مؤتمر
المصدر: Proceedings of 2002 IEEE 14th International Conference on Dielectric Liquids. ICDL 2002 (Cat. No.02CH37319) Dielectric liquids Dielectric Liquids, 2002. ICDL 2002. Proceedings of 2002 IEEE 14th International Conference on. :373-376 2002
Relation: Proceedings of 14th International Conference on Dielectric Liquids
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9مؤتمر
المؤلفون: Kobayashi, F., Fukui, T., Fukuda, T., Kojima, F., Onoda, M., Hotta, Y.
المصدر: Conference Documentation International Conference on Multisensor Fusion and Integration for Intelligent Systems. MFI 2001 (Cat. No.01TH8590) Multisensor fusion and integration for intelligent systems Multisensor Fusion and Integration for Intelligent Systems, 2001. MFI 2001. International Conference on. :121-126 2001
Relation: Proceedings on International Conference on Multi-Sensor Fusion and Integration for Intelligent Systems
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10مؤتمر
المصدر: Proceedings of 2001 International Symposium on Electrical Insulating Materials (ISEIM 2001). 2001 Asian Conference on Electrical Insulating Diagnosis (ACEID 2001). 33rd Symposium on Electrical and Ele Electrical insulating materials Electrical Insulating Materials, 2001. (ISEIM 2001). Proceedings of 2001 International Symposium on. :475-478 2001
Relation: Proceedings of 2001 International Symposium on Electrical Insulating Materials (ISEIM 2001) 2001 Asia Conference on Electrical Insulation Diagnosis (ACEID 2001). 33rd Symposium on Electrical and Electronic Insulating Materials and Applications in Systems
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