يعرض 1 - 8 نتائج من 8 نتيجة بحث عن '"Ooi, R. C."', وقت الاستعلام: 1.03s تنقيح النتائج
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    مؤتمر

    المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :127-132 Oct, 2012

    Relation: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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    دورية أكاديمية

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(11):1786-1795 Nov, 2012

  3. 3
    دورية أكاديمية

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(4):593-603 Apr, 2012

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    دورية أكاديمية
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    دورية أكاديمية
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    دورية أكاديمية
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    دورية أكاديمية

    المؤلفون: Ooi RC; Department of Mechanical Engineering, The University of Sheffield, Mappin Street, Sheffield, S1 3JD, UK., Luo XY, Chin SB, Johnson AG, Bird NC

    المصدر: Journal of biomechanics [J Biomech] 2004 Dec; Vol. 37 (12), pp. 1913-22.

    نوع المنشور: Journal Article; Research Support, Non-U.S. Gov't

    بيانات الدورية: Publisher: Elsevier Science Country of Publication: United States NLM ID: 0157375 Publication Model: Print Cited Medium: Print ISSN: 0021-9290 (Print) Linking ISSN: 00219290 NLM ISO Abbreviation: J Biomech Subsets: MEDLINE