المؤلفون: Glaubitz, C., Thalmann, R., Friedrichson, T., Ariffin, M.A., Bieck, F., Teutsch, T., Oppert, T.

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :948-953 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Oppert, T., Kloeser, J.

المصدر: IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International. :327-330 2003

Relation: 28th International Electronics Manufacturing Technology Symposium

المؤلفون: Teutsch, T., Oppert, T., Zakel, E., Klusmann, E., Meyer, H., Schulz, R., Schulze, J.

المصدر: 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :107-113 2000

Relation: 2000 Proceedings. 50th Electronic Components and Technology Conference

المؤلفون: Oppert, T., Teutsch, T., Zakel, E.

المصدر: International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Electronic materials and packaging Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on. :72-78 2000

Relation: International Symposium on Electronic Materials and Packaging (EMAP2000)

المؤلفون: Oppert, T., Teutsch, T., Zakel, E., Tovar, D.

المصدر: Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT. :328-333 1999

Relation: Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium

المؤلفون: Kasulke, P., Oppert, T., Zakel, E., Titerle, L.

المصدر: Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Multichip modules and high density packaging Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on. :330-336 1998

Relation: Proceedings 1998 International Conference on Multichip Modules and High Density Packaging

المؤلفون: Oppert, T., Zakel, E., Teutsch, T.

المصدر: 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Electronic manufacturing technology and microelectronics IEMT/IMC Symposium, 2nd 1998. :106-113 1998

Relation: 2nd 1998 IEMT/IMC Symposium

المؤلفون: Kasulke, P., Schmidt, W., Titerle, L., Bohnaker, H., Oppert, T., Zakel, E.

المصدر: Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) Electronic manufacturing technology. IEMT-Europe Electronics Manufacturing Technology Symposium, 1998. IEMT-Europe 1998. Twenty-Second IEEE/CPMT International. :70-75 1998

Relation: Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe. Electronics Manufacturing and Development for Automotives

المؤلفون: Oppert, T., Azdasht, G., Zakel, E., Teutsch, T.

المصدر: 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium Electronics Manufacturing and Technology, 31st International Conference on. :86-86 Nov, 2006

Relation: 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium

المؤلفون: Franke, J., Dohle, R., Schusler, F., Oppert, T., Friedrich, T., Harter, S.

المصدر: 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p893-900, 8p