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1دورية أكاديمية
المصدر: IEEE Transactions on Geoscience and Remote Sensing IEEE Trans. Geosci. Remote Sensing Geoscience and Remote Sensing, IEEE Transactions on. 62:1-15 2024
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2مؤتمر
المؤلفون: Mirzaee, Mohammad Amin, Sadighi, Ali
المصدر: 2023 11th RSI International Conference on Robotics and Mechatronics (ICRoM) Robotics and Mechatronics (ICRoM), 2023 11th RSI International Conference on. :562-567 Dec, 2023
Relation: 2023 11th RSI International Conference on Robotics and Mechatronics (ICRoM)
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3مؤتمر
المؤلفون: Fu, Mingli, Li, Pengli, Liu, Yijie, Jia, Lei, Luo, Bing, Zhu, Wenbo, Liu, Xiangyu, Jiang, Pingkai, Huang, Xingyi
المصدر: 2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE) Electrical Materials and Power Equipment (ICEMPE), 2023 IEEE 4th International Conference on. :1-4 May, 2023
Relation: 2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE)
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4مؤتمر
المؤلفون: Kettelgerdes, Marcel, Mezmer, Peter, Haeussler, Michael J., Bottger, Gunnar, Tavakolibasti, Majid, Pandey, Amit, Erdogan, Huseyin, Elger, Gordon, Schacht, Ralph, Wunderle, Bernhard
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :753-760 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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5مؤتمر
المؤلفون: James, Briley M., Zavareh, Amir T., McShane, Michael J.
المصدر: 2022 IEEE Sensors Sensors, 2022 IEEE. :1-4 Oct, 2022
Relation: 2022 IEEE Sensors
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6دورية أكاديمية
المؤلفون: Pasupathy, K. R.Aff1, IDs1108202407265y_cor1, Ramachandran, A. V.Aff1, Aff2, Ragul, S., Barah, Dhruvajyoti, Mani, R., Bairava Ganesh, R., Nair, Deleep R., Dutta, Soumya, Ray, DebduttaAff1, IDs1108202407265y_cor9
المصدر: Optical and Quantum Electronics. 56(8)
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7مؤتمر
المؤلفون: Tavakolibasti, M., Meszmer, P., Kettelgerdes, M., Bottger, G., Elger, G., Erdogan, H., Seshaditya, A., Wunderle, B.
المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-7 Apr, 2022
Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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8كتاب إلكتروني
المؤلفون: Chai, Jasman Y. H.Aff13, Wong, Basil T.Aff13, Juodkazis, SauliusAff14
المساهمون: Chaari, Fakher, Series EditorAff1, Gherardini, Francesco, Series EditorAff2, Ivanov, Vitalii, Series EditorAff3, Haddar, Mohamed, Series EditorAff4, Cavas-Martínez, Francisco, Editorial Board MemberAff5, di Mare, Francesca, Editorial Board MemberAff6, Kwon, Young W., Editorial Board MemberAff7, Trojanowska, Justyna, Editorial Board MemberAff8, Xu, Jinyang, Editorial Board MemberAff9, Ahmad, Faiz, editorAff10, Iskandar, Taib, editorAff11, Habib, Khairul, editorAff12
المصدر: ICREEM 2022 : Proceedings of the International Conference on Renewable Energy and E-mobility. :13-22
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9دورية أكاديمية
المؤلفون: Jiji, ChrispinAff1, IDs4187002301586z_cor1, Nandhini, V. L., Malini, V. L., Rodriguez, R. Ciro
المصدر: International Journal of Information Technology: An Official Journal of Bharati Vidyapeeth's Institute of Computer Applications and Management. 16(2):1137-1143
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10دورية أكاديمية
المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(13):12967-12975 Jul, 2022