المؤلفون: Ji, F., Wang, J., Cui, S., Li, J., Tang, X., Xu, F.

المصدر: IEEE Transactions on Geoscience and Remote Sensing IEEE Trans. Geosci. Remote Sensing Geoscience and Remote Sensing, IEEE Transactions on. 62:1-15 2024

المؤلفون: Mirzaee, Mohammad Amin, Sadighi, Ali

المصدر: 2023 11th RSI International Conference on Robotics and Mechatronics (ICRoM) Robotics and Mechatronics (ICRoM), 2023 11th RSI International Conference on. :562-567 Dec, 2023

Relation: 2023 11th RSI International Conference on Robotics and Mechatronics (ICRoM)

المؤلفون: Fu, Mingli, Li, Pengli, Liu, Yijie, Jia, Lei, Luo, Bing, Zhu, Wenbo, Liu, Xiangyu, Jiang, Pingkai, Huang, Xingyi

المصدر: 2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE) Electrical Materials and Power Equipment (ICEMPE), 2023 IEEE 4th International Conference on. :1-4 May, 2023

Relation: 2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE)

المؤلفون: Kettelgerdes, Marcel, Mezmer, Peter, Haeussler, Michael J., Bottger, Gunnar, Tavakolibasti, Majid, Pandey, Amit, Erdogan, Huseyin, Elger, Gordon, Schacht, Ralph, Wunderle, Bernhard

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :753-760 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: James, Briley M., Zavareh, Amir T., McShane, Michael J.

المصدر: 2022 IEEE Sensors Sensors, 2022 IEEE. :1-4 Oct, 2022

Relation: 2022 IEEE Sensors

المؤلفون: Pasupathy, K. R.^{Aff1, IDs1108202407265y_cor1}, Ramachandran, A. V.^{Aff1, Aff2}, Ragul, S., Barah, Dhruvajyoti, Mani, R., Bairava Ganesh, R., Nair, Deleep R., Dutta, Soumya, Ray, Debdutta^{Aff1, IDs1108202407265y_cor9}

المصدر: Optical and Quantum Electronics. 56(8)

المؤلفون: Tavakolibasti, M., Meszmer, P., Kettelgerdes, M., Bottger, G., Elger, G., Erdogan, H., Seshaditya, A., Wunderle, B.

المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-7 Apr, 2022

Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Chai, Jasman Y. H.^Aff13, Wong, Basil T.^Aff13, Juodkazis, Saulius^Aff14

المساهمون: Chaari, Fakher, Series Editor^Aff1, Gherardini, Francesco, Series Editor^Aff2, Ivanov, Vitalii, Series Editor^Aff3, Haddar, Mohamed, Series Editor^Aff4, Cavas-Martínez, Francisco, Editorial Board Member^Aff5, di Mare, Francesca, Editorial Board Member^Aff6, Kwon, Young W., Editorial Board Member^Aff7, Trojanowska, Justyna, Editorial Board Member^Aff8, Xu, Jinyang, Editorial Board Member^Aff9, Ahmad, Faiz, editor^Aff10, Iskandar, Taib, editor^Aff11, Habib, Khairul, editor^Aff12

المصدر: ICREEM 2022 : Proceedings of the International Conference on Renewable Energy and E-mobility. :13-22

المؤلفون: Jiji, Chrispin^{Aff1, IDs4187002301586z_cor1}, Nandhini, V. L., Malini, V. L., Rodriguez, R. Ciro

المصدر: International Journal of Information Technology: An Official Journal of Bharati Vidyapeeth's Institute of Computer Applications and Management. 16(2):1137-1143

المؤلفون: Lee, B., Choi, B., Bang, H., Koh, Y.N., Han, K.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(13):12967-12975 Jul, 2022