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1دورية أكاديمية
المؤلفون: Minhaz Abedin, Nanbo Gong, Karsten Beckmann, Maximilian Liehr, Iqbal Saraf, Oscar Van der Straten, Takashi Ando, Nathaniel Cady
المصدر: Scientific Reports, Vol 13, Iss 1, Pp 1-10 (2023)
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2045-2322
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2
المؤلفون: Maxwell Lippitt, Virat Mehta, Donald F. Canaperi, Jessica Gruss-Gifford, Oscar van der Straten, Gabriel Rodriguez
المصدر: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: Materials science, Nuclear engineering, Plasma, Grain size, Cathode, law.invention, Ignition system, Physics::Plasma Physics, Sputtering, law, Physical vapor deposition, Cavity magnetron, Hot-filament ionization gauge, Physics::Chemical Physics
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9b59086904b15550650b26978be19aa0
https://doi.org/10.1109/asmc49169.2020.9185236 -
3
المؤلفون: Takeshi Nogami, Chih-Chao Yang, Oscar van der Straten, Nicholas A. Lanzillo, Andrew H. Simon, Daniel C. Edelstein
المصدر: Journal of Vacuum Science & Technology A. 38:053402
مصطلحات موضوعية: Materials science, Surfaces and Interfaces, Condensed Matter Physics, Engineering physics, Line (electrical engineering), Surfaces, Coatings and Films, Metal deposition, Back end of line, Atomic layer deposition, CMOS, Physical vapor deposition, Hardware_INTEGRATEDCIRCUITS, Deposition (phase transition), Thin film
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4
المصدر: Chemical Engineering Communications. 198:1453-1481
مصطلحات موضوعية: Interconnection, Reliability (semiconductor), Materials science, Diffusion barrier, General Chemical Engineering, Rectangular potential barrier, Nanotechnology, General Chemistry, Diffusion (business), Nanoscopic scale, Scaling, Microscale chemistry
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5
المصدر: Journal of Materials Research. 21:255-262
مصطلحات موضوعية: Materials science, Mechanical Engineering, Analytical chemistry, Nucleation, Refractory metals, chemistry.chemical_element, Adhesion, Condensed Matter Physics, Copper, Contact angle, chemistry, Chemical engineering, Mechanics of Materials, General Materials Science, Wetting, Forming gas, Indium
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6
المصدر: Journal of Materials Research. 19:447-453
مصطلحات موضوعية: Materials science, Mechanical Engineering, Inorganic chemistry, Tantalum, chemistry.chemical_element, Condensed Matter Physics, Aspect ratio (image), Copper, chemistry.chemical_compound, Atomic layer deposition, Chemical engineering, chemistry, Tantalum nitride, Mechanics of Materials, General Materials Science, Process window, Inert gas, Carbon
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7
المؤلفون: James J. Kelly, Terry A. Spooner, C.-K. Hu, X. Zhang, Motoyama Koichi, A. Simon, Raghuveer R. Patlolla, Oscar van der Straten, Hosadurga Shobha, Ming He, James Chingwei Li, Timothy M. Shaw, Kunaljeet Tanwar, Daniel C. Edelstein, Takeshi Nogami, Stephan A. Cohen, Moosung M. Chae, Elbert E. Huang, X. Lin, Griselda Bonilla, S. H. Chen, Christopher J. Penny
المصدر: IEEE International Interconnect Technology Conference.
مصطلحات موضوعية: Barrier layer, Materials science, Reliability (semiconductor), Diffusion barrier, business.industry, Optoelectronics, Nanotechnology, Diffusion (business), business, Electromigration
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::818cfbb973a824603c3322facc72f165
https://doi.org/10.1109/iitc.2014.6831875 -
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المؤلفون: X. Zhang, Hosadurga Shobha, C. Parks, Ming He, X. Lin, Donald F. Canaperi, A. Simon, Anita Madan, James Chingwei Li, Raghuveer R. Patlolla, Kunaljeet Tanwar, Daniel C. Edelstein, J. Maniscalco, Oscar van der Straten, Philip L. Flaitz, Mahadevaiyer Krishnan, Christopher J. Penny, James J. Kelly, David L. Rath, Chenming Hu, Terry A. Spooner, Takeshi Nogami, Tibor Bolom
المصدر: 2013 IEEE International Interconnect Technology Conference - IITC.
مصطلحات موضوعية: Void (astronomy), Materials science, Chemical engineering, Electrical resistivity and conductivity, Metallurgy, Alloy, engineering, Copper interconnect, Nucleation, Chemical vapor deposition, Wetting, engineering.material, Wet chemistry
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::95a5fa2e9ef1fbefa9504d9b2ac43a7e
https://doi.org/10.1109/iitc.2013.6615592 -
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المؤلفون: Neal Lafferty, Hosadurga Shobha, Wenhui Wang, Terry A. Spooner, Tae-Soo Kim, Matthew E. Colburn, Yann Mignot, Yongan Xu, Yunpeng Yin, Benjamin Duclaux, Shyng-Tsong Chen, Chiew-seng Koay, Marcy Beard, James J. Kelly, Oscar van der Straten, Seowoo Nam, Ming He, Nicole Saulnier
المصدر: 2013 IEEE International Interconnect Technology Conference - IITC.
مصطلحات موضوعية: Scheme (programming language), Nanolithography, Materials science, Copper interconnect, Multiple patterning, Electronic engineering, Process (computing), computer, Trim, Dot pitch, Block (data storage), computer.programming_language
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::39a5d247773726f8e5f9ada178ac4257
https://doi.org/10.1109/iitc.2013.6615589 -
10
المؤلفون: Scott Halle, Marcy Beard, Chiew-seng Koay, Oscar van der Straten, T. Levin, Lars Liemann, Juntao Li, D. Horak, Bryan Morris, Terry A. Spooner, S. Choi, Carol Boye, Donald F. Canaperi, Sylvie Mignot, Muthumanickam Sankarapandian, Elbert E. Huang, Chiahsun Tseng, James Hsueh-Chung Chen, Erin Mclellan, James J. Kelly, S. Fan, James J. Demarest, Nicole Saulnier, Hosadurga Shobha, Matthew E. Colburn, Balasubramanian S. Haran, Yongan Xu, Yunpeng Yin, Larry Clevenger, Christopher J. Waskiewicz, Mignot Yann, John C. Arnold
المصدر: 2012 IEEE International Interconnect Technology Conference.
مصطلحات موضوعية: Interconnection, Materials science, business.industry, Copper interconnect, chemistry.chemical_element, Copper, Line (electrical engineering), chemistry, Logic gate, Electronic engineering, Optoelectronics, business, Layer (electronics), Lithography
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f371baddebc7d64eac10bf2c213e8ee5
https://doi.org/10.1109/iitc.2012.6251637