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1دورية أكاديمية
المؤلفون: Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen
المصدر: Materials, Vol 15, Iss 5, p 1888 (2022)
مصطلحات موضوعية: Cu/SiO2 hybrid bonding, highly (111)-nanotwinned Cu, low temperature bonding, microelectronic packaging, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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المؤلفون: Chia-Hsin Lee, Baron Huang, Jennifer See, Luke Prenger, Yu-Min Lin, Wei-Lan Chiu, Ou-Hsiang Lee, Kuan-Neng Chen
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:692-699
مصطلحات موضوعية: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials
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المؤلفون: Jia-Juen Ong, Dinh-Phuc Tran, Yu-Min Hsun, Wei-Lan Chiu, Ou-Hsiang Lee, Hsiang-Hung Chang, Chih Chen
المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a66139431605596f89d2c074ca6307ca
https://doi.org/10.1109/impact56280.2022.9966728 -
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المؤلفون: Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Hsiang-Hung Chang, Chih Chen
المصدر: 2022 International Conference on Electronics Packaging (ICEP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ba502f7dc16ba5608c810f6d3fa5dbe3
https://doi.org/10.23919/icep55381.2022.9795579 -
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المؤلفون: Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::63aeb1d0afcd76cbed026aed3dee03cd
https://doi.org/10.1109/ectc51906.2022.00114 -
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المؤلفون: Jia-Juen, Ong, Wei-Lan, Chiu, Ou-Hsiang, Lee, Chia-Wen, Chiang, Hsiang-Hung, Chang, Chin-Hung, Wang, Kai-Cheng, Shie, Shih-Chi, Yang, Dinh-Phuc, Tran, King-Ning, Tu, Chih, Chen
المصدر: Materials (Basel, Switzerland). 15(5)
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المؤلفون: Chia-Hsin Lee, Wei-Chung Lo, Ou-Hsiang Lee, Yu-Min Lin, Lin Ang-Ying, Sheng-Tsai Wu, Xiao Liu, Te Pei Hsiang, Hsiang-En Ding, Tao-Chih Chang, Chao-Jung Chen, Ren-Shin Cheng, Baron Huang, Wei-Lan Chiu, Jennifer See, Hsiang-Hung Chang, Chang-Chun Lee
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Packaging engineering, Computer science, business.industry, Interposer, Three-dimensional integrated circuit, Power integrity, Chip, business, Daisy chain, Wafer-level packaging, Flip chip, Computer hardware
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7d3d13c4028baa0082c4ffc6e4c0dfb7
https://doi.org/10.1109/ectc32696.2021.00176 -
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المؤلفون: Chia-Wen Chiang, Hsiang-Hung Chang, Tsung-Yu Ou Yang, Huan-Chun Fu, Chih-Cheng Hsiao, Ou-Hsiang Lee
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Adhesive bonding, Chemical-mechanical planarization, Shear strength, Surface roughness, Wafer dicing, Adhesive, Direct bonding, Composite material, Focused ion beam
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b87c2e1d54e9bb050fefee464c2acd60
https://doi.org/10.1109/ectc32696.2021.00081 -
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المؤلفون: Hsiang-Hung Chang, Ren-Shin Cheng, Jennifer See, Hsiang-En Ding, Wei-Lan Chiu, Lin Ang-Ying, Kuan-Neng Chen, Chao-Jung Chen, Yu-Min Lin, Baron Huang, Chia-Hsin Lee, Ou-Hsiang Lee, Tao-Chih Chang, Xiao Liu, Sheng-Tsai Wu
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Wafer-scale integration, Laser ablation, Materials science, business.industry, Molding (process), engineering.material, Laser, law.invention, Coating, law, Transmittance, engineering, Optoelectronics, Wafer, business, Wafer-level packaging
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5d9cb5864f0802f644f35212e9dcc2a5
https://doi.org/10.1109/ectc32696.2021.00127 -
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المؤلفون: Wei-Lan Chiu, Ying Tzu Hung, Wei-Chung Lo, Hsiang-Hung Chang, Ou-Hsiang Lee, Tsung Yu Ou-Yang
المصدر: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
مصطلحات موضوعية: Interconnection, Materials science, business.industry, 020209 energy, chemistry.chemical_element, 02 engineering and technology, Copper, Annealing (glass), chemistry, Impurity, Thermal, 0202 electrical engineering, electronic engineering, information engineering, Microelectronics, Thermal stability, Composite material, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0972b8a6ca2c29d08c22d1ee5c7331d4
https://doi.org/10.1109/vlsi-tsa51926.2021.9440121