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1
المؤلفون: P.D. Foo, C.Y. Li, L.Y. Yang, Dao Hua Zhang, P.W. Lu, Andrew T. S. Wee, Rong Liu
المصدر: Thin Solid Films. 504:265-268
مصطلحات موضوعية: Materials science, Metals and Alloys, Low-k dielectric, Mineralogy, Surfaces and Interfaces, Dielectric, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Amorphous solid, Barrier layer, Materials Chemistry, Grain boundary, Thermal stability, Metallizing, Composite material, Sheet resistance
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2
المؤلفون: Dao Hua Zhang, P.D. Foo, C.Y. Li, L.Y. Yang, Ping Lu
المصدر: Thin Solid Films. 504:235-238
مصطلحات موضوعية: Line resistance, Materials science, Bilayer, Materials Chemistry, Metals and Alloys, Copper interconnect, Breakdown voltage, Thermal stability, Surfaces and Interfaces, Composite material, Layer (electronics), Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials
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3
المؤلفون: Dao Hua Zhang, L.Y. Yang, Rong Liu, Andrew T. S. Wee, P.D. Foo, C.Y. Li
المصدر: Thin Solid Films. :182-185
مصطلحات موضوعية: Chemistry, Annealing (metallurgy), Metals and Alloys, Analytical chemistry, Tantalum, chemistry.chemical_element, Surfaces and Interfaces, Dielectric, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Secondary ion mass spectrometry, Transition metal, X-ray crystallography, Materials Chemistry, Thermal stability, Sheet resistance
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4
المؤلفون: P.D. Foo, C.Y. Li, Dao Hua Zhang, L.Y. Yang
المصدر: Thin Solid Films. :176-181
مصطلحات موضوعية: chemistry.chemical_classification, Nanostructure, Chemistry, Metals and Alloys, Tantalum, chemistry.chemical_element, Surfaces and Interfaces, Polymer, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Amorphous solid, Materials Chemistry, Breakdown voltage, Grain boundary, Thermal stability, Composite material, Sheet resistance
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5
المؤلفون: Andrew T. S. Wee, L.Y. Yang, Rong Liu, P.D. Foo, C.Y. Li, Dao Hua Zhang
المصدر: International Journal of Nanoscience. :471-479
مصطلحات موضوعية: Diffraction, chemistry.chemical_classification, Materials science, Diffusion, Analytical chemistry, Low-k dielectric, Bioengineering, Nanotechnology, Polymer, Condensed Matter Physics, Computer Science Applications, Secondary ion mass spectrometry, chemistry, General Materials Science, Thermal stability, Electrical and Electronic Engineering, Porosity, Sheet resistance, Biotechnology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9431d78c23cc691052cd82e7550f0739
https://doi.org/10.1142/s0219581x04002279 -
6
المؤلفون: Dao Hua Zhang, Andrew T. S. Wee, Rong Liu, L.Y. Yang, P.D. Foo, C.Y. Li
المصدر: International Journal of Nanoscience. :481-487
مصطلحات موضوعية: chemistry.chemical_classification, Materials science, Annealing (metallurgy), Analytical chemistry, Bioengineering, Dielectric, Polymer, Condensed Matter Physics, Computer Science Applications, Secondary ion mass spectrometry, chemistry, Transmission electron microscopy, General Materials Science, Thermal stability, Electrical and Electronic Engineering, Porosity, Sheet resistance, Biotechnology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ec2f121b2ffe501d63bcc936ae830f82
https://doi.org/10.1142/s0219581x04002280 -
7
المؤلفون: Y.J. Su, B. Yu, P.D. Foo, Y.S. Zheng
المصدر: Microelectronics Reliability. 43:1311-1316
مصطلحات موضوعية: Copper oxide, Wire bonding, Materials science, Plasma etching, Passivation, Metallurgy, Contact resistance, Copper interconnect, chemistry.chemical_element, Condensed Matter Physics, Copper, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, chemistry, Copper plating, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality
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8
المؤلفون: Y.S. Zheng, Y.J. Su, Q. Guo, P.D. Foo
المصدر: Microelectronics Journal. 34:109-113
مصطلحات موضوعية: chemistry.chemical_classification, Auger electron spectroscopy, Materials science, Plasma etching, Contact resistance, General Engineering, Copper interconnect, chemistry.chemical_element, Polymer, Copper, chemistry, Chemical engineering, Chlorine, Metallizing
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9
المؤلفون: B Narayanan, P.D Foo, R Kumar
المصدر: Microelectronics Journal. 33:971-974
مصطلحات موضوعية: chemistry.chemical_compound, Carbon film, Materials science, chemistry, Plasma-enhanced chemical vapor deposition, General Engineering, Analytical chemistry, Deposition (phase transition), Trimethylsilane, Chemical vapor deposition, Fourier transform infrared spectroscopy, Combustion chemical vapor deposition, Thin film
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10
المصدر: Microelectronics Journal. 33:229-234
مصطلحات موضوعية: Materials science, Annealing (metallurgy), Metallurgy, General Engineering, chemistry.chemical_element, Electromigration, Copper, Secondary ion mass spectrometry, chemistry, Forensic engineering, Copper plating, Grain boundary, Metallizing, Electroplating