المؤلفون: Alshraida, Hamzeh, Santos, Daryl, Chen, Bruce, Dabous, Iman, Aguilar, Talbert

المصدر: 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific) Pan Pacific Strategic Electronics Symposium (Pan Pacific), 2024. :1-6 Jan, 2024

Relation: 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific)

المؤلفون: Lu, G., Yu, X., Sun, H., Li, Z., Qiu, J., Gao, H.

المصدر: IEEE Transactions on Industrial Informatics IEEE Trans. Ind. Inf. Industrial Informatics, IEEE Transactions on. 20(3):3609-3618 Mar, 2024

المؤلفون: Wang, Chia-Nan, Nhieu, Nhat-Luong^{Aff1, IDs00170024140255_cor2}, Viet, Tien-Anh Pham^{Aff1, Aff2}

المصدر: The International Journal of Advanced Manufacturing Technology. 133(11-12):5529-5552

المؤلفون: Queiros, Mauro, Pereira, Joao Lobato, Leiras, Valdemar, Meireles, Jose, Fonseca, Jaime, Borges, Joao

المصدر: 2022 IEEE 27th International Conference on Emerging Technologies and Factory Automation (ETFA) Emerging Technologies and Factory Automation (ETFA), 2022 IEEE 27th International Conference on. :1-4 Sep, 2022

Relation: 2022 IEEE 27th International Conference on Emerging Technologies and Factory Automation (ETFA)

المؤلفون: He, Guanghui, Yu, Sida, Wang, Hongqin, Liang, Chaohui, Yang, Shaodong

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Jin, Xing, Wang, Wenlong, Zhao, Wenzhong, Zhang, Yuting, Tan, Xiaopeng, Chen, Shuai

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Jeon, M., Yoo, S., Kim, S.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(3):489-501 Mar, 2022

المؤلفون: Jacob, Peter

المصدر: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2019 IEEE 26th International Symposium on. :1-6 Jul, 2019

Relation: 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Zhou, Jia-cheng, Liu, Fang, Nu, Yan

المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :25-29 Aug, 2017

Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Liu, Haiming, Yuan, Peng, Luo, Jiaxiang, Zhang, Mei

المصدر: 2017 36th Chinese Control Conference (CCC) Control Conference (CCC), 2017 36th Chinese. :2876-2881 Jul, 2017

Relation: 2017 36th Chinese Control Conference (CCC)