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1مؤتمر
المؤلفون: Alshraida, Hamzeh, Santos, Daryl, Chen, Bruce, Dabous, Iman, Aguilar, Talbert
المصدر: 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific) Pan Pacific Strategic Electronics Symposium (Pan Pacific), 2024. :1-6 Jan, 2024
Relation: 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific)
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2دورية أكاديمية
المصدر: IEEE Transactions on Industrial Informatics IEEE Trans. Ind. Inf. Industrial Informatics, IEEE Transactions on. 20(3):3609-3618 Mar, 2024
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3دورية أكاديمية
المؤلفون: Wang, Chia-Nan, Nhieu, Nhat-LuongAff1, IDs00170024140255_cor2, Viet, Tien-Anh PhamAff1, Aff2
المصدر: The International Journal of Advanced Manufacturing Technology. 133(11-12):5529-5552
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4مؤتمر
المؤلفون: Queiros, Mauro, Pereira, Joao Lobato, Leiras, Valdemar, Meireles, Jose, Fonseca, Jaime, Borges, Joao
المصدر: 2022 IEEE 27th International Conference on Emerging Technologies and Factory Automation (ETFA) Emerging Technologies and Factory Automation (ETFA), 2022 IEEE 27th International Conference on. :1-4 Sep, 2022
Relation: 2022 IEEE 27th International Conference on Emerging Technologies and Factory Automation (ETFA)
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5مؤتمر
المؤلفون: He, Guanghui, Yu, Sida, Wang, Hongqin, Liang, Chaohui, Yang, Shaodong
المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022
Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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6مؤتمر
المؤلفون: Jin, Xing, Wang, Wenlong, Zhao, Wenzhong, Zhang, Yuting, Tan, Xiaopeng, Chen, Shuai
المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021
Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
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7دورية أكاديمية
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(3):489-501 Mar, 2022
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8مؤتمر
المؤلفون: Jacob, Peter
المصدر: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2019 IEEE 26th International Symposium on. :1-6 Jul, 2019
Relation: 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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9مؤتمر
المؤلفون: Zhou, Jia-cheng, Liu, Fang, Nu, Yan
المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :25-29 Aug, 2017
Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)
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10مؤتمر
المؤلفون: Liu, Haiming, Yuan, Peng, Luo, Jiaxiang, Zhang, Mei
المصدر: 2017 36th Chinese Control Conference (CCC) Control Conference (CCC), 2017 36th Chinese. :2876-2881 Jul, 2017
Relation: 2017 36th Chinese Control Conference (CCC)