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1مؤتمر
المؤلفون: Delpoux, Adrien, Ran, Sijia, Claverie, Alain, Benoit, Daniel, Grisolia, Jeremie
المصدر: 2024 IEEE 5th International Conference on Dielectrics (ICD) Dielectrics (ICD), 2024 IEEE 5th International Conference on. :1-4 Jun, 2024
Relation: 2024 IEEE 5th International Conference on Dielectrics (ICD)
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2مؤتمر
المؤلفون: Wang, Hongyu, Yan, Hongfeng, Cao, Tiejun, Zhong, Wei, Jin, Hui, Nie, Yongjie
المصدر: 2022 IEEE Smartworld, Ubiquitous Intelligence & Computing, Scalable Computing & Communications, Digital Twin, Privacy Computing, Metaverse, Autonomous & Trusted Vehicles (SmartWorld/UIC/ScalCom/DigitalTwin/PriComp/Meta) SMARTWORLD-UIC-SCALCOM-DIGITALTWIN-PRICOMP-META Smartworld, Ubiquitous Intelligence & Computing, Scalable Computing & Communications, Digital Twin, Privacy Computing, Metaverse, Autonomous & Trusted Vehicles (SmartWorld/UIC/ScalCom/DigitalTwin/PriComp/Meta), 2022 IEEE. :1590-1596 Dec, 2022
Relation: 2022 IEEE Smartworld, Ubiquitous Intelligence & Computing, Scalable Computing & Communications, Digital Twin, Privacy Computing, Metaverse, Autonomous & Trusted Vehicles (SmartWorld/UIC/ScalCom/DigitalTwin/PriComp/Meta)
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3مؤتمر
المؤلفون: Boixaderas, C., Canvel, Y., Fontaine, B., Lagrasta, S., Dubois, J., Gouraud, P., Posseme, N., Martinez, E.
المصدر: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023
Relation: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
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4مؤتمر
المؤلفون: Yan, Hongfeng, Cao, Tiejun, Nie, Yongjie, Zhong, Wei, Jin, Hui, Wang, Hongyu
المصدر: 2022 3rd International Conference on Big Data, Artificial Intelligence and Internet of Things Engineering (ICBAIE) Big Data, Artificial Intelligence and Internet of Things Engineering (ICBAIE), 2022 3rd International Conference on. :738-741 Jul, 2022
Relation: 2022 3rd International Conference on Big Data, Artificial Intelligence and Internet of Things Engineering (ICBAIE)
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5مؤتمر
المؤلفون: Jin, Hui, Cao, Tiejun, Nie, Yongjie, Shen, Jun, Yan, Hongfeng, Wang, Hongyu
المصدر: 2022 3rd International Conference on Big Data, Artificial Intelligence and Internet of Things Engineering (ICBAIE) Big Data, Artificial Intelligence and Internet of Things Engineering (ICBAIE), 2022 3rd International Conference on. :255-260 Jul, 2022
Relation: 2022 3rd International Conference on Big Data, Artificial Intelligence and Internet of Things Engineering (ICBAIE)
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6دورية أكاديمية
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(12):6510-6522 Dec, 2022
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7كتاب إلكتروني
المؤلفون: Cai, YimaoAff5, Xu, JunAff6, Liang, RenrongAff6, Huang, QianqianAff5, Wang, ZongweiAff5
المساهمون: Wang, Yangyuan, editorAff1, Chi, Min-Hwa, editorAff2, Lou, Jesse Jen-Chung, editorAff3, Chen, Chun-Zhang, editorAff4
المصدر: Handbook of Integrated Circuit Industry. :1803-1827
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8مؤتمر
المؤلفون: Wang, Hongyu, Zhong, Wei, Song, Zhitang, Jin, Hui, Li, Wenqiang, Tao, Jun
المصدر: 2021 IEEE Sustainable Power and Energy Conference (iSPEC) Sustainable Power and Energy Conference (iSPEC), 2021 IEEE. :4150-4157 Dec, 2021
Relation: 2021 IEEE Sustainable Power and Energy Conference (iSPEC)
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9دورية أكاديمية
المؤلفون: Qiang Wang, Yachuan Wang, Yankun Wang, Luyue Jiang, Jinyan Zhao, Zhitang Song, Jinshun Bi, Libo Zhao, Zhuangde Jiang, Jutta Schwarzkopf, Shengli Wu, Bin Zhang, Wei Ren, Sannian Song, Gang Niu
المصدر: InfoMat, Vol 6, Iss 8, Pp n/a-n/a (2024)
مصطلحات موضوعية: electronic synapses, neuromorphic computing, PCRAM, Ru‐doped Ge2Sb2Te5, Materials of engineering and construction. Mechanics of materials, TA401-492, Information technology, T58.5-58.64
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2567-3165
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10مؤتمر
المؤلفون: Zhang, Xingyao, Guo, Qi, Zhou, Dong, Li, Yudong
المصدر: 2021 4th International Conference on Radiation Effects of Electronic Devices (ICREED) Radiation Effects of Electronic Devices (ICREED), 2021 4th International Conference on. :1-6 May, 2021
Relation: 2021 4th International Conference on Radiation Effects of Electronic Devices (ICREED)