المؤلفون: Foleis, Gabriel Lucas, Colman, Flávio Clareth^{Aff1, Aff2, IDs0033902407637x_cor2}, da Silva, Nicholas Dicati Pereira, Foleis, Juliano Henrique, Imamura, William^{Aff1, Aff4}, da Silva, Emilly Ramos Freitas, Dada, Eliana Carla, de Oliveira, Júlio Cesar Dainezi

المصدر: Applied Physics A: Materials Science & Processing. 130(7)

المؤلفون: Zimmermann, Camila A., Amouzou, Koffi N., Demarquette, Nicole R., Ung, Bora

المصدر: 2023 Photonics North (PN) Photonics North (PN), 2023. :1-1 Jun, 2023

Relation: 2023 Photonics North (PN)

المؤلفون: Yang, Jiandong, Imamura, Satoshi, Hirai, Yoshikazu, Kamei, Ken-ichiro, Tsuchiya, Toshiyuki, Tabata, Osamu

المصدر: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) SSolid-State Sensors, Actuators and Microsystems (Transducers), 2021 21st International Conference on. :176-179 Jun, 2021

Relation: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

المؤلفون: de Castro, Ana Cristina Honorato, Ferrarezi, Lucas, Gomes, Alberth Wagner, de Lima, Rafaela Vitti, Lucho, Alzira Maria Serpa, Pisseti, Fabio Luiz^{Aff1, IDs10971023060563_cor6}

المصدر: Journal of Sol-Gel Science and Technology. 106(1):236-245

المؤلفون: Li, Cai-Fu, Zhang, Bowen, Suganuma, Katsuaki, Zhang, Hao, Sugahara, Tohru, Li, Wanli, Liu, Zhi-Quan

المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :1022-1025 Aug, 2018

Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Benítez-Martínez, Jorge Alejandro^{Aff1, Aff2}, Garnica-Palafox, Itzel Marisol, Rodríguez-Hernández, Adriana, Pérez-Calixto, Daniel^{Aff3, Aff4}, Vázquez-Victorio, Genaro, Hernádez-Gordillo, Agileo, Sánchez-Arévalo, Francisco Manuel^{Aff1, IDs00339023068219_cor7}

المصدر: Applied Physics A: Materials Science & Processing. 129(8)

المؤلفون: Simorangkir, Roy B. V. B., Yang, Yang, Esselle, Karu P., Diao, Yinliang

المصدر: 2017 IEEE MTT-S International Microwave Symposium (IMS) Microwave Symposium (IMS), 2017 IEEE MTT-S International. :204-207 Jun, 2017

Relation: 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

المؤلفون: Danielle M. Beaupre, Alexander K. Goroncy, Richard G. Weiss

المصدر: Macromol, Vol 3, Iss 1, Pp 36-53 (2023)

مصطلحات موضوعية: crosslinking, poly(dimethylsiloxane), thiols, disulfides, Chemical technology, TP1-1185, Biochemistry, QD415-436

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2673-6209/3/1/4; https://doaj.org/toc/2673-6209

URL الوصول: https://doaj.org/article/1903130dfef941eda5cc2547a21cdf78

المؤلفون: Nobuhiro Nagai, Reiko Daigaku, Remi Motoyama, Hirokazu Kaji, Toshiaki Abe

المصدر: Journal of Materials Science: Materials in Medicine, Vol 34, Iss 1, Pp 1-8 (2022)

مصطلحات موضوعية: Drug delivery system, Poly(dimethylsiloxane), Retina, Transscleral delivery, Age-related macular disease, Choroidal neovascularization, Materials of engineering and construction. Mechanics of materials, TA401-492, Medical technology, R855-855.5

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1573-4838

URL الوصول: https://doaj.org/article/08b22e6ab74d4f33a5c60af497abd769

المؤلفون: Guan, Yong, Zeng, Qinghua, Chen, Jing, Meng, Wei, Jin, Yufeng, Ma, Shenglin

المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :162-164 Aug, 2017

Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)