المؤلفون: Chen, Lei, Li, Xiaoli, Wang, Kang, Yu, Xiaowei

المصدر: 2024 36th Chinese Control and Decision Conference (CCDC) Control and Decision Conference (CCDC), 2024 36th Chinese. :76-81 May, 2024

Relation: 2024 36th Chinese Control and Decision Conference (CCDC)

المؤلفون: Saranraj, Kumaravel, Liu, Chuan-Ming

المصدر: 2023 IEEE 5th International Conference on Architecture, Construction, Environment and Hydraulics (ICACEH) Architecture, Construction, Environment and Hydraulics (ICACEH), 2023 IEEE 5th International Conference on. :44-49 Dec, 2023

Relation: 2023 IEEE 5th International Conference on Architecture, Construction, Environment and Hydraulics (ICACEH)

المؤلفون: Diab, Mohamed, Nossair, Zaki, Badr, Hesham

المصدر: 2023 International Conference on Computer and Applications (ICCA) Computer and Applications (ICCA), 2023 International Conference on. :1-5 Nov, 2023

Relation: 2023 International Conference on Computer and Applications (ICCA)

المؤلفون: Li, Shang, Wang, Mengdi, Qi, Shuguang, Jia, Jun, Wang, Zhongbiao, Zhao, Ning

المصدر: 2023 International Conference on Computing, Electronics & Communications Engineering (iCCECE) Computing, Electronics & Communications Engineering (iCCECE), 2023 International Conference on. :44-49 Aug, 2023

Relation: 2023 International Conference on Computing, Electronics & Communications Engineering (iCCECE)

المؤلفون: Zhang, Yingbo, Li, Hangxin^{Aff1, IDs1227302411679_cor2}, Wang, Shengwei^{Aff1, Aff2, IDs1227302411679_cor3}

المصدر: Building Simulation: An International Journal. :1-16

المؤلفون: Shukla, Kavita, Singh, Shraddha^{Aff2, Aff3}, Srivastava, Sudhakar^{Aff1, IDs00344024114237_cor3}

المصدر: Journal of Plant Growth Regulation. :1-14

المؤلفون: Tan, Xianguang, Liu, Hongmei, Zhang, Jiajun, Tian, Wenbin, Yu, Jiang, Ruan, Xingping, Wang, Baolin, Wu, Lihui, Zhang, Jun, Ahuja, Nishi

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-7 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Gui, Chenglong, Wang, Yulong, Shen, Chen, Wang, Shifeng, Wang, Ruidong, Lv, Zhichao, Lin, Bin, Tian, Wenbin, Li, Zhiming, Zhang, Xu, Zhang, Ken, Wu, Lihui, Ahuja, Nishi

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-6 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Wang, Yulong, Gui, Chenglong, Cheng, Pengfei, Shen, Chen, Wang, Ruidong, Lv, Zhichao, Lin, Bin, Tian, Wenbin, Li, Zhiming, Zhang, Xu, Zhang, Ken, Wu, Lihui, Ahuja, Nishi

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-7 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Tibaldi, M., Pilato, C.

المصدر: IEEE Transactions on Sustainable Computing IEEE Trans. Sustain. Comput. Sustainable Computing, IEEE Transactions on. 8(3):343-362 Sep, 2023