يعرض 1 - 10 نتائج من 180 نتيجة بحث عن '"Pal, Dipankar"', وقت الاستعلام: 1.37s تنقيح النتائج
  1. 1
    مؤتمر
    Deploying Artificial Intelligence in Design Verification to Accelerate IP/SoC Sign-off with Zero Escape

    المؤلفون: Bhattacherjee, Surajit, Shah, Daksh, Pal, Dipankar

    المصدر: 2024 IEEE 6th International Conference on AI Circuits and Systems (AICAS) AI Circuits and Systems (AICAS), 2024 IEEE 6th International Conference on. :477-481 Apr, 2024

    Relation: 2024 IEEE 6th International Conference on AI Circuits and Systems (AICAS)

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  2. 2
    مؤتمر
    A 2bit/stage Reusability based methodology for designing 8-bit Binary Search ADC

    المؤلفون: Kumar, Sachin, Dipti, Bandla, Kasi, Pal, Dipankar, Goswami, Manish

    المصدر: 2023 IEEE Region 10 Symposium (TENSYMP) Region 10 Symposium (TENSYMP), 2023 IEEE. :1-6 Sep, 2023

    Relation: 2023 IEEE Region 10 Symposium (TENSYMP)

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  3. 3
    تقرير
    Strong-ARM Dynamic Latch Comparators: Design and Analyses on CAD Platform

    المؤلفون: Bandla, Kasi, Pal, Dipankar

    مصطلحات موضوعية: Electrical Engineering and Systems Science - Systems and Control

    URL الوصول: http://arxiv.org/abs/2402.14519

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  4. 4
    مؤتمر
    IP Transformation Initiatives to Generate Scalable Functional Verification Collaterals for Smart Reusability and Reduced Effort for Sign-off

    المؤلفون: Bhattacherjee, Surajit, Pal, Dipankar

    المصدر: 2023 International Conference on Computing, Networking and Communications (ICNC) Computing, Networking and Communications (ICNC), 2023 International Conference on. :626-629 Feb, 2023

    Relation: 2023 International Conference on Computing, Networking and Communications (ICNC)

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  5. 5
    مؤتمر
    Functional Verification Measures to Challenge State Retention Strategy for Inaccessible Power-Gating of Low Power IPs

    المؤلفون: Bhattacherjee, Surajit, Pal, Dipankar, Jalagar, Channabasapa M

    المصدر: 2022 International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME) Electrical, Computer, Communications and Mechatronics Engineering (ICECCME), 2022 International Conference on. :1-4 Nov, 2022

    Relation: 2022 International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME)

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  6. 6
    مؤتمر
    Square Wave Generator Using Second Generation Current Controlled Conveyor (CCCII)

    المؤلفون: Syed, Zahiruddin, Srinivasulu, Avireni, Musala, Sarada, Pal, Dipankar, Bhargav, Appasani

    المصدر: 2022 1st IEEE International Conference on Industrial Electronics: Developments & Applications (ICIDeA) Industrial Electronics: Developments & Applications (ICIDeA), 2022 1st IEEE International Conference on-. :29-34 Oct, 2022

    Relation: 2022 1st IEEE International Conference on Industrial Electronics: Developments & Applications (ICIDeA)

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  7. 7
    دورية أكاديمية
    A case of miltefosine responsive pleomorphic post kala-azar dermal leishmaniasis

    المؤلفون: Pal, Dipankar, Naskar, Arindam, Ghosh, Manab Kumar

    المصدر: Brazilian Journal of Infectious Diseases. October 2013 17(5)

    وصف الملف: text/html

    URL الوصول: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1413-86702013000500016

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  8. 8
    دورية أكاديمية
    Role of plasma process gas on permeate flux augmentation of cellulose nitrate membrane for mud water treatment

    المؤلفون: Hazarika, TonmoiAff1, Aff2, Aff3, Kakati, BharatAff1, IDs41598024569489_cor2, Pal, DipankarAff3, IDs41598024569489_cor3, Saikia, RimleeAff1, Aff2, Rawal, Ankit, Mahanta, Manoj Kumar, Biswas, Subir

    المصدر: Scientific Reports. 14(1)

    Find this article in full text from Springer Verlag. Find this article in full text from ProQuest Full Text Finder
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  9. 9
    مؤتمر
    Novel All-Pass Section for High-Performance Signal Processing Using CMOS DCCII

    المؤلفون: Nizam, Taaha, Vijay, V., Srinivasulu, A., Pal, Dipankar

    المصدر: TENCON 2021 - 2021 IEEE Region 10 Conference (TENCON) Region 10 Conference (TENCON), TENCON 2021 - 2021 IEEE. :7-10 Dec, 2021

    Relation: TENCON 2021 - 2021 IEEE Region 10 Conference (TENCON)

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  10. 10
    مؤتمر
    Design of an ASIC-Based High Speed 32-bit Floating Point Adder

    المؤلفون: Deka, Debarshi, Kumar, Navaneeth, Pal, Dipankar

    المصدر: 2021 International Conference on Applied Electronics (AE) Applied Electronics (AE), 2021 International Conference on. :1-4 Sep, 2021

    Relation: 2021 International Conference on Applied Electronics (AE)

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