المؤلفون: Mondal, Somnath, Patkar, Sachin, Pal, T K

المصدر: 2023 36th International Conference on VLSI Design and 2023 22nd International Conference on Embedded Systems (VLSID) VLSID VLSI Design and 2023 22nd International Conference on Embedded Systems (VLSID), 2023 36th International Conference on. :1-6 Jan, 2023

Relation: 2023 36th International Conference on VLSI Design and 2023 22nd International Conference on Embedded Systems (VLSID)

المؤلفون: Mondal, Somnath, Patkar, Sachin, Pal, T K

المصدر: 2022 IEEE 7th International conference for Convergence in Technology (I2CT) Convergence in Technology (I2CT), 2022 IEEE 7th International conference for. :1-6 Apr, 2022

Relation: 2022 IEEE 7th International conference for Convergence in Technology (I2CT)

المؤلفون: Gupta, Vrinda Brajesh, Pal, T. K., Bajpai, R. K.

المصدر: Current Science, 2020 Feb 01. 118(3), 439-443.

URL الوصول: https://www.jstor.org/stable/27138675

المؤلفون: Das, S.^Aff1, Pal, T. K., Jana, R. N.

المصدر: BioNanoScience. 11(3):848-870

المؤلفون: Latha, S.^Aff1, Selvamani, P., Suganya, G., Thimiri Govinda Raj, Deepak B., Pal, T. K.

المصدر: BioNanoScience. 11(2):643-647

المؤلفون: Das, S.^Aff1, Pal, T. K., Jana, R. N.

المصدر: BioNanoScience. 11(1):99-115

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المؤلفون: Das, H.^Aff1, Das, C. R.^{Aff2, Aff3}, Divya, M., Albert, S. K.^{Aff2, Aff3}, Pal, T. K.^{Aff1, Aff4}

المصدر: Journal of Materials Engineering and Performance. 29(12):7765-7773

المؤلفون: Kumar, Manish^Aff35, Pal, T. K.^Aff35, Prasad, B. S. V.^Aff35, Arun Kumar, G.^Aff36, Bhanja, Sukhendu^Aff36, Majumder, Arijit^Aff36

المساهمون: Angrisani, Leopoldo, Series Editor^Aff1, Arteaga, Marco, Series Editor^Aff2, Panigrahi, Bijaya Ketan, Series Editor^Aff3, Chakraborty, Samarjit, Series Editor^Aff4, Chen, Jiming, Series Editor^Aff5, Chen, Shanben, Series Editor^Aff6, Chen, Tan Kay, Series Editor^Aff7, Dillmann, Ruediger, Series Editor^Aff8, Duan, Haibin, Series Editor^Aff9, Ferrari, Gianluigi, Series Editor^Aff10, Ferre, Manuel, Series Editor^Aff11, Hirche, Sandra, Series Editor^Aff12, Jabbari, Faryar, Series Editor^Aff13, Jia, Limin, Series Editor^Aff14, Kacprzyk, Janusz, Series Editor^Aff15, Khamis, Alaa, Series Editor^Aff16, Kroeger, Torsten, Series Editor^Aff17, Liang, Qilian, Series Editor^Aff18, Ming, Tan Cher, Series Editor^Aff19, Minker, Wolfgang, Series Editor^Aff20, Misra, Pradeep, Series Editor^Aff21, Möller, Sebastian, Series Editor^Aff22, Mukhopadhyay, Subhas, Series Editor^Aff23, Ning, Cun-Zheng, Series Editor^Aff24, Nishida, Toyoaki, Series Editor^Aff25, Pascucci, Federica, Series Editor^Aff26, Qin, Yong, Series Editor^Aff27, Seng, Gan Woon, Series Editor^Aff28, Veiga, Germano, Series Editor^Aff29, Wu, Haitao, Series Editor^Aff30, Zhang, Junjie James, Series Editor^Aff31, Bera, Rabindranath, editor^Aff32, Sarkar, Subir Kumar, editor^Aff33, Chakraborty, Swastika, editor^Aff34

المصدر: Advances in Communication, Devices and Networking : Proceedings of ICCDN 2017. 462:439-445

المؤلفون: Sarkar, T., Pramanick, Ajit Kumar, Sahoo, S. K., Pal, T. K.^Aff1, Pramanick, Akshay Kumar

المصدر: Journal of Materials Engineering and Performance. 28(4):2071-2085