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1مؤتمر
المؤلفون: Mondal, Somnath, Patkar, Sachin, Pal, T K
المصدر: 2023 36th International Conference on VLSI Design and 2023 22nd International Conference on Embedded Systems (VLSID) VLSID VLSI Design and 2023 22nd International Conference on Embedded Systems (VLSID), 2023 36th International Conference on. :1-6 Jan, 2023
Relation: 2023 36th International Conference on VLSI Design and 2023 22nd International Conference on Embedded Systems (VLSID)
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2مؤتمر
المؤلفون: Mondal, Somnath, Patkar, Sachin, Pal, T K
المصدر: 2022 IEEE 7th International conference for Convergence in Technology (I2CT) Convergence in Technology (I2CT), 2022 IEEE 7th International conference for. :1-6 Apr, 2022
Relation: 2022 IEEE 7th International conference for Convergence in Technology (I2CT)
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3دورية أكاديمية
المؤلفون: Gupta, Vrinda Brajesh, Pal, T. K., Bajpai, R. K.
المصدر: Current Science, 2020 Feb 01. 118(3), 439-443.
URL الوصول: https://www.jstor.org/stable/27138675
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4دورية أكاديمية
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5دورية أكاديمية
المؤلفون: Latha, S.Aff1, Selvamani, P., Suganya, G., Thimiri Govinda Raj, Deepak B., Pal, T. K.
المصدر: BioNanoScience. 11(2):643-647
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6دورية أكاديمية
المؤلفون: Das, S.Aff1, Pal, T. K., Jana, R. N.
المصدر: BioNanoScience. 11(1):99-115
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7دورية أكاديمية
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8دورية أكاديمية
المؤلفون: Das, H.Aff1, Das, C. R.Aff2, Aff3, Divya, M., Albert, S. K.Aff2, Aff3, Pal, T. K.Aff1, Aff4
المصدر: Journal of Materials Engineering and Performance. 29(12):7765-7773
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9كتاب إلكتروني
المؤلفون: Kumar, ManishAff35, Pal, T. K.Aff35, Prasad, B. S. V.Aff35, Arun Kumar, G.Aff36, Bhanja, SukhenduAff36, Majumder, ArijitAff36
المساهمون: Angrisani, Leopoldo, Series EditorAff1, Arteaga, Marco, Series EditorAff2, Panigrahi, Bijaya Ketan, Series EditorAff3, Chakraborty, Samarjit, Series EditorAff4, Chen, Jiming, Series EditorAff5, Chen, Shanben, Series EditorAff6, Chen, Tan Kay, Series EditorAff7, Dillmann, Ruediger, Series EditorAff8, Duan, Haibin, Series EditorAff9, Ferrari, Gianluigi, Series EditorAff10, Ferre, Manuel, Series EditorAff11, Hirche, Sandra, Series EditorAff12, Jabbari, Faryar, Series EditorAff13, Jia, Limin, Series EditorAff14, Kacprzyk, Janusz, Series EditorAff15, Khamis, Alaa, Series EditorAff16, Kroeger, Torsten, Series EditorAff17, Liang, Qilian, Series EditorAff18, Ming, Tan Cher, Series EditorAff19, Minker, Wolfgang, Series EditorAff20, Misra, Pradeep, Series EditorAff21, Möller, Sebastian, Series EditorAff22, Mukhopadhyay, Subhas, Series EditorAff23, Ning, Cun-Zheng, Series EditorAff24, Nishida, Toyoaki, Series EditorAff25, Pascucci, Federica, Series EditorAff26, Qin, Yong, Series EditorAff27, Seng, Gan Woon, Series EditorAff28, Veiga, Germano, Series EditorAff29, Wu, Haitao, Series EditorAff30, Zhang, Junjie James, Series EditorAff31, Bera, Rabindranath, editorAff32, Sarkar, Subir Kumar, editorAff33, Chakraborty, Swastika, editorAff34
المصدر: Advances in Communication, Devices and Networking : Proceedings of ICCDN 2017. 462:439-445
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10دورية أكاديمية
المؤلفون: Sarkar, T., Pramanick, Ajit Kumar, Sahoo, S. K., Pal, T. K.Aff1, Pramanick, Akshay Kumar
المصدر: Journal of Materials Engineering and Performance. 28(4):2071-2085