المؤلفون: Chiou, Hong-Wen, Jiang, Jia-Hao, Chang, Yu-Teng, Lee, Yu-Min, Pan, Chi-Wen

المصدر: 2023 28th Asia and South Pacific Design Automation Conference (ASP-DAC) Design Automation Conference (ASP-DAC), 2023 28th Asia and South Pacific. :7-12 Jan, 2023

Relation: 2023 28th Asia and South Pacific Design Automation Conference (ASP-DAC)

المؤلفون: Peng, Li-Hsun^Aff25, Pan, Chi-Yu^Aff25, Indarti^Aff26, Jerusalem, Mohammad Adam^Aff27

المساهمون: Goos, Gerhard, Series Editor^Aff1, Hartmanis, Juris, Founding Editor^Aff2, van Leeuwen, Jan, Series Editor^Aff3, Hutchison, David, Editorial Board Member^Aff4, Kanade, Takeo, Editorial Board Member^Aff5, Kittler, Josef, Editorial Board Member^Aff6, Kleinberg, Jon M., Editorial Board Member^Aff7, Kobsa, Alfred, Series Editor^Aff8, Mattern, Friedemann, Editorial Board Member^Aff9, Mitchell, John C., Editorial Board Member^Aff10, Naor, Moni, Editorial Board Member^Aff11, Nierstrasz, Oscar, Series Editor^Aff12, Pandu Rangan, C., Editorial Board Member^Aff13, Sudan, Madhu, Series Editor^Aff14, Terzopoulos, Demetri, Editorial Board Member^Aff15, Tygar, Doug, Editorial Board Member^Aff16, Weikum, Gerhard, Series Editor^Aff17, Vardi, Moshe Y, Series Editor^Aff18, Bertino, Elisa, Editorial Board Member^Aff19, Gao, Wen, Editorial Board Member^Aff20, Steffen, Bernhard, Editorial Board Member^Aff21, Yung, Moti, Editorial Board Member^Aff22, Woeginger, Gerhard, Editorial Board Member^Aff23, Rauterberg, Matthias, editor^Aff24

المصدر: Culture and Computing : 12th International Conference, C&C 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Washington, DC, USA, June 29 – July 4, 2024, Proceedings. 14717:309-324

المؤلفون: Peng, Li-Hsun^Aff16, Pan, Chi-Yu^Aff17, Creativani, Kharisma^Aff18

المساهمون: Striełkowski, Wadim, Editor-in-Chief^Aff1, Black, Jessica M., Series Editor^Aff2, Butterfield, Stephen A., Series Editor^Aff3, Chang, Chi-Cheng, Series Editor^Aff4, Cheng, Jiuqing, Series Editor^Aff5, Dumanig, Francisco Perlas, Series Editor^Aff6, Al-Mabuk, Radhi, Series Editor^Aff7, Scheper-Hughes, Nancy, Series Editor^Aff8, Urban, Mathias, Series Editor^Aff9, Webb, Stephen, Series Editor^Aff10, Kuswandi, Paramita Cahyaningrum, editor^Aff11, Apino, Ezi, editor^Aff12, Ramadhan, Syahri, editor^Aff13, Susetyaningsih, Ririn, editor^Aff14, Widiastuti, Siwi, editor^Aff15

المصدر: Proceedings of the 6th International Conference on Current Issues in Education (ICCIE) 2023. 847:232-239

المؤلفون: Chen, Dao-Long, Chang, Hui-Jing, Chen, Tang-Yuan, Hu, Yung-Hsiang, Chen, Ting-Bin, Pan, Chi-Hung, Yang, Yu-Shuo, Hwang, Sheng-Jye

المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :115-116 Apr, 2023

Relation: 2023 International Conference on Electronics Packaging (ICEP)

المؤلفون: Anchuan Li, Miaobin Mao, Runfan Chen, Pan Chi, Ying Huang, Junxin Wu, Benhua Xu

المصدر: Discover Oncology, Vol 15, Iss 1, Pp 1-13 (2024)

مصطلحات موضوعية: Clinical target volume, External iliac node, Rectal cancer, Anterior structures, Radiotherapy, Neoplasms. Tumors. Oncology. Including cancer and carcinogens, RC254-282

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2730-6011

URL الوصول: https://doaj.org/article/1a24b0dd34f04fe7ac030ac535a2d3ea

المؤلفون: Lin, Zhao-He, Chou, Hsi-Tseng, Shen, Pin-Zhong, Lin, Ding-Bing, Yang, Chao-Shun, Chou, Chieh-Wei, Pan, Chi-Liang, Lin, Chun-Te, Lin, Ji-Cheng, Fang, Li-Chih

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1812-1818 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Wu, Kuan-Hsun, Lin, Zhao-He, Chou, Hsi-Tseng, Shen, Pin-Zhong, Lin, Ding-Bing, Yang, Chao-Shun, Chou, Chieh-Wei, Pan, Chi-Liang, Lin, Ji-Cheng, Fang, Li-Chih

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :577-582 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Wu, Kuan-Hsun, Chou, Hsi-Tseng, Lin, Ding-Bing, Yang, Chao-Shun, Chou, Chieh-Wei, Pan, Chi-Liang, Lin, Chun-Te, Lin, Ji-Cheng, Fang, Li-Chih, Ivashina, Marianna

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1162-1168 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Holbrook, Madisen, Chen, Yuxuan, Kim, Hyunsue, Frammolino, Lisa, Liu, Mengke, Pan, Chi-Ruei, Chou, Mei-Yin, Zhang, Chengdong, Shih, Chih-Kang

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/2208.04532

المؤلفون: Dao-xiong Ye, Sheng-hui Huang, Yu Lin, Ying-Huang, Pan Chi

المصدر: Trials, Vol 25, Iss 1, Pp 1-11 (2024)

مصطلحات موضوعية: Rectovaginal fistula, Fat flap containing ovarian vascular pedicle, Ovarian function failure, Post-menopause, Rectal cancer, Randomized controlled trial, Medicine (General), R5-920

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1745-6215

URL الوصول: https://doaj.org/article/9e161babd1a841278ab2cf13871565ad