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1
المؤلفون: Panayotis C. Andricacos, Hariklia Deligianni, Alan C. West
المصدر: IBM Journal of Research and Development. 49:37-48
مصطلحات موضوعية: Electropolishing, Interconnection, Materials science, General Computer Science, Chemical-mechanical planarization, Metallurgy, Copper interconnect, Context (language use), Electroplating, Electrochemistry, Engineering physics, Anode
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2
المؤلفون: C. Cabral, Lynne Gignac, Kenneth P. Rodbell, James Mckell Edwin Harper, Ismail C. Noyan, Panayotis C. Andricacos, Chao-Kun Hu
المصدر: Journal of Applied Physics. 86:2516-2525
مصطلحات موضوعية: Grain growth, Materials science, Metallurgy, food and beverages, General Physics and Astronomy, Grain boundary diffusion coefficient, Grain boundary, Texture (crystalline), Abnormal grain growth, Composite material, Microstructure, Grain size, Grain boundary strengthening
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3
المؤلفون: Hariklia Deligianni, Cyprian E. Uzoh, J. Horkans, John Owen Dukovic, Panayotis C. Andricacos
المصدر: IBM Journal of Research and Development. 42:567-574
مصطلحات موضوعية: Engineering, Interconnection, Void (astronomy), General Computer Science, business.industry, Metallurgy, Hardware_INTEGRATEDCIRCUITS, Copper plating, Copper interconnect, Optoelectronics, business, Electroplating, Chip
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4
المؤلفون: Panayotis C. Andricacos, Lubomyr T. Romankiw
المصدر: Advances in Electrochemical Science and Engineering, Volume 3
مصطلحات موضوعية: Materials science, business.industry, Saturated calomel electrode, Computer data storage, Optoelectronics, Electrochemistry, business, Air bearing surface, Soft materials, Direct-access storage device
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2a53c75f6f40ee6be2c2892c1bb53630
https://doi.org/10.1002/9783527616770.ch5 -
5
المؤلفون: Lubomyr T. Romankiw, Panayotis C. Andricacos
المصدر: ChemInform. 26
مصطلحات موضوعية: business.industry, Chemistry, Computer data storage, Nanotechnology, General Medicine, business, Electrochemistry, Soft materials
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6
المؤلفون: James Gardner Ryan, Sampath Purushothaman, Panayotis C. Andricacos, Daniel C. Edelstein, Satya V. Nitta, Thomas M. Shaw, James R. Lloyd, Robert Rosenberg, Chao-Kun Hu
المصدر: Interconnect Technology and Design for Gigascale Integration ISBN: 9781461350880
مصطلحات موضوعية: Interconnection, Materials science, Transistor, Copper interconnect, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit, Chip, Engineering physics, Line (electrical engineering), law.invention, CMOS, law, Chemical-mechanical planarization, Hardware_INTEGRATEDCIRCUITS, Hardware_LOGICDESIGN
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::647f0ce54213943dcd8508587ead21b8
https://doi.org/10.1007/978-1-4615-0461-0_2 -
7
المؤلفون: Jennifer L. Lund, Raul E. Acosta, Lili Deligianni, Christopher V. Jahnes, Arpan P. Mahorowala, Joanna Rosner, David E. Seeger, Inna V. Babich, John M. Cotte, Paivikki Buchwalter, Panayotis C. Andricacos
المصدر: Emerging Lithographic Technologies VI.
مصطلحات موضوعية: Microelectromechanical systems, Engineering, business.industry, Semiconductor device fabrication, Electrical engineering, Integrated circuit, Chip, Handset, law.invention, Capacitor, law, visual_art, Electronic component, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, visual_art.visual_art_medium, Wireless, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f023e1109d727d3fb3554b2b75859711
https://doi.org/10.1117/12.472298 -
8
المؤلفون: Ismail C. Noyan, Panayotis C. Andricacos, James Mckell Edwin Harper, Chenming Hu, Cyril Cabral, Lynne Gignac, Kenneth P. Rodbell
المصدر: MRS Proceedings. 564
مصطلحات موضوعية: Stress (mechanics), Materials science, Electrical resistivity and conductivity, Ultimate tensile strength, Grain boundary, Texture (crystalline), Composite material, Electroplating, Microstructure, Grain size
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2cb341568d8f7f7823dc4c98b4f47e8d
https://doi.org/10.1557/proc-564-387 -
9
المؤلفون: R. B. Beyers, Peter S. Locke, Panayotis C. Andricacos, Cyril Cabral, Stanley J. Klepeis, Lynne Gignac, Kenneth P. Rodbell, Philip M. Rice
المصدر: MRS Proceedings. 562
مصطلحات موضوعية: Grain growth, Materials science, Annealing (metallurgy), Scanning transmission electron microscopy, Grain boundary, Thin film, Composite material, Microstructure, Focused ion beam, Grain size
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5da1ccb30778450d615e2d129d9504a6
https://doi.org/10.1557/proc-562-209 -
10
المؤلفون: Panayotis C. Andricacos, Kason Wong, M. L. Komsa, Aloysius Theodore Pfeiffer, S. Mehdizadeh, Sol Krongelb, Lubomyr T. Romankiw, John Owen Dukovic
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Materials science, Resist, business.industry, Plating, Microelectronics, Nanotechnology, Photoresist, business, Electroplating, Layer (electronics), Engineering physics, Electrical conductor, Electrical contacts
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::04fd84b8bd5d4a18677f609c4efc8d17
https://doi.org/10.1117/12.25527