المؤلفون: Che, F.X., Pang, H.L.J., Wong, F.L., Lim, G.H., Low, T.H.

المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :107-113 2003

Relation: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)

المؤلفون: Wang, Y.Q., Low, K.H., Che, F.X., Pang, H.L.J., Yeo, S.P.

المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :263-268 2003

Relation: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)

المؤلفون: Pang, H.L.J., Zhang, X.R., Lim, C.H., Shi, X.Q., Wang, Z.P.

المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1640-1644 2002

Relation: Proceedings of 52nd Electronic Components and Technology Conference

المؤلفون: Pang, H.L.J., Zhang, X.R., Shi, X.Q., Wang, Z.P.

المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1757-1761 2002

Relation: Proceedings of 52nd Electronic Components and Technology Conference

المؤلفون: Shi, X.Q., Yang, Q.J., Wang, Z.P., Pang, H.L.J., Zhou, W.

المصدر: Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) Electronic packaging technology Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd. :398-405 2000

Relation: Proceedings of 3rd Electronics Packaging Technology Conference

المؤلفون: Pang, H.L.J., Ang, K.H., Shi, X.Q., Wang, Z.P.

المصدر: Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) Electronic packaging technology Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd. :385-390 2000

Relation: Proceedings of 3rd Electronics Packaging Technology Conference

المؤلفون: Pang, H.L.J., Bong, S.N., Shi, X.Q., Wang, Z.P.

المصدر: International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Electronic materials and packaging Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on. :197-200 2000

Relation: International Symposium on Electronic Materials and Packaging (EMAP2000)

المؤلفون: Pang, H.L.J., Wang, Y.P., Shi, X.Q., Wang, Z.P.

المصدر: Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) Electronics packaging technology Electronics Packaging Technology Conference, 1998. Proceedings of 2nd. :184-189 1998

Relation: Proceedings of 2nd Electronics Packaging Technology Conference

المؤلفون: Yang, Q.J., Lim, G.H., Pang, H.L.J., Wang, Z.P.

المصدر: Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) Electronics packaging technology Electronics Packaging Technology Conference, 1998. Proceedings of 2nd. :258-263 1998

Relation: Proceedings of 2nd Electronics Packaging Technology Conference

المؤلفون: Shi, X.Q., Pang, H.L.J., Zhou, W., Yang, Q.J.

المصدر: Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) Electronics packaging technology Electronics Packaging Technology Conference, 1998. Proceedings of 2nd. :308-312 1998

Relation: Proceedings of 2nd Electronics Packaging Technology Conference