المؤلفون: Pang, J.H.L., Fa-Xing Che

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :1011-1017 2006

Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems

المؤلفون: Yaofeng Sun, Pang, J.H.L., Xunqing Shi, Tew, J.W.R.

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :921-927 2006

Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems

المؤلفون: Fa-Xing Che, Pang, J.H.L., Xu, L.H.

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :1018-1023 2006

Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems

المؤلفون: Chong, D.Y.R., Kellin Ng, Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Xu, L.H.

المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :622-629 2005

Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference

المؤلفون: Luhua Xu, Pang, J.H.L., Che, F.X.

المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :682-686 2005

Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference

المؤلفون: Ren, F., Nah, J.W., Suh, J.O., Tu, K.N., Xiong, B.S., Xu, L.H., Pang, J.H.L.

المصدر: Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :66-69 2005

Relation: 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

المؤلفون: Luhua Xu, Pang, J.H.L., Che Faxing

المصدر: Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the. :323-327 2005

Relation: Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits

المؤلفون: Che, F.X., Pang, J.H.L.

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :205-209 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)

المؤلفون: Chong, D.Y.R., Ng, K., Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X.

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :210-217 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)

المؤلفون: Luhua Xu, Pang, J.H.L., Xiong, B.S.

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :410-413 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)