المؤلفون: Yi-Shao Lai, Pao-Huei Chang-Chien, Chi-Wen Chang, Tsung-Yueh Tsai, Sung-Ching Hung, Tseng, Andy, Keiji Takai, Tetsuyuki Hirashima

المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :964-967 May, 2008

Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

المؤلفون: T. Hirashima, Yi-Shao Lai, Chi-Wen Chang, Pao-Huei Chang-Chien, An-Shih Tseng, Keiji Takai, Sung-Ching Hung, Tsung-Yueh Tsai

المصدر: 2008 58th Electronic Components and Technology Conference.

مصطلحات موضوعية: Fabrication, Materials science, Wafer-scale integration, Chip-scale package, Ball grid array, Electronic packaging, Electronic engineering, Integrated circuit packaging, Quad Flat No-leads package

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7d03571d96dab55a8d01b5f2d378c5e0
https://doi.org/10.1109/ectc.2008.4550092