يعرض 1 - 10 نتائج من 109 نتيجة بحث عن '"Paquay S"', وقت الاستعلام: 0.91s تنقيح النتائج
  1. 1
    مؤتمر

    المصدر: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on. :1-4 Apr, 2016

    Relation: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

  2. 2
    مؤتمر

    المصدر: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on. :1-5 2006

    Relation: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

  3. 3
    دورية أكاديمية

    المصدر: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 53(4):1-5 Apr, 2017

  4. 4
    تقرير

    المصدر: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)

    مصطلحات موضوعية: Computer Science - Other Computer Science

    URL الوصول: http://arxiv.org/abs/0711.3277

  5. 5
    كتاب إلكتروني

    المؤلفون: Hoang, T. V.Aff4, Wu, L.Aff4, Paquay, S.Aff5, Golinval, J.-C.Aff4, Arnst, M.Aff4, Noels, L.Aff4

    المساهمون: Starman, La Vern, editorAff1, Hay, Jennifer, editorAff2, Karanjgaokar, Nikhil, editorAff3

    المصدر: Micro and Nanomechanics, Volume 5 : Proceedings of the 2016 Annual Conference on Experimental and Applied Mechanics. :1-8

  6. 6
  7. 7
    مؤتمر

    المصدر: 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on. :1/6-6/6 Apr, 2011

    Relation: 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

  8. 8
    مؤتمر

    المصدر: 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on. :1/6-6/6 Apr, 2011

    Relation: 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

  9. 9
    دورية أكاديمية
  10. 10
    دورية أكاديمية