المؤلفون: Pares, G., Jean-Philippe, Michel, Edouard, Deschaseaux, Pierre, Ferris, Ayssar, Serhan, Alexandre, Giry

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1279-1286 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Testa, F., Tondini, S., Gambini, F., Velha, P., Bianchi, A., Kopp, C., Hofbauer, M., Manganelli, C.L., Zecevic, N., Faralli, S., Pares, G., Enne, R., Serrano, A., Goll, B., Fontana, G., Chalyan, A., Lee, J., Pintus, P., Chiaretti, G., Zimmermann, H., Pavesi, L., Oton, C.J., Stracca, S.

المصدر: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 37(2):345-355 Jan, 2019

المؤلفون: Vignetti, M. M., Calmon, F., Pittet, P., Pares, G., Cellier, R., Qmquerez, L., Savoy-Navarro, A.

المصدر: 2016 IEEE Nuclear Science Symposium, Medical Imaging Conference and Room-Temperature Semiconductor Detector Workshop (NSS/MIC/RTSD) Nuclear Science Symposium, Medical Imaging Conference and Room-Temperature Semiconductor Detector Workshop (NSS/MIC/RTSD), 2016. :1-7 Oct, 2016

Relation: 2016 IEEE Nuclear Science Symposium, Medical Imaging Conference and Room-Temperature Semiconductor Detector Workshop (NSS/MIC/RTSD)

المؤلفون: Hoffman, A. C. Abusleme, Parès, G., Fritzsch, T., Rothermund, M., Jansen, H., Krüger, K., Sefkow, F., Velyka, A., Schwandt, J., Perić, I., Emberger, L., Graf, C., Macchiolo, A., Simon, F., Szalay, M., van der Kolk, N., Abramowicz, H., Benhammou, Y., Borysov, O., Borysova, M., Joffe, A., Kananov, S., Levy, A., Levy, I., Eigen, G., Bugiel, R., Bugiel, S., Firlej, M., Fiutowski, T. A., Idzik, M., Moroń, J., Świentek, K. P., Terlecki, P., de Renstrom, P. Brückman, Turbiarz, B., Wojtoń, T., Zawiejski, L. K., Firu, E., Ghenescu, V., Neagu, A. T., Preda, T., Boyko, I., Nefedov, Yu., Rymbekova, A., Sapronov, A., Shelkov, G., Zhemchugov, A., Ruiz-Jimeno, A., Vila, I., Fullana, E., Fuster, J., Lopez, P. Gomis, Perelló, M., Villarejo, M. A., Vos, M., Alozy, J., Tehrani, N. Alipour, Arominski, D., Sune, R. Ballabriga, Boyer, F., Brondolin, E., Buckland, M., Campbell, M., Dannheim, D., Dette, K., Ramos, F. Duarte, Plaja, N. Egidos, Elsener, K., Fiergolski, A., Rojas, C. Fuentes, Grefe, C., Hynds, D., Klempt, W., Kremastiotis, I., Kröger, J., Kulis, S., Leogrande, E., Linssen, L., Cudie, X. Llopart, Lucaci-Timoce, A., Munker, M., Musa, L., Nürnberg, A., Nuiry, F. -X., Codina, E. Perez, Pernegger, H., Petrič, M., Pitters, F., Quast, T., Redford, S., Riedler, P., Roloff, P., Sailer, A., Santin, E., Schnoor, U., Sicking, E., Sielewicz, K., Simoniello, R., Snoeys, W., Spannagel, S., Sroka, S., Ström, R., Valerio, P., van Dam, S., van der Kraaij, E., Vǎnát, T., Viazlo, O., Pinto, M. Vicente Barreto, Weber, M. A., Williams, M., Wolters, K., Benoit, M., Iacobucci, G., Sultan, D M S, Bosley, R. R., Price, T., Watson, M. F., Watson, N. K., Winter, A. G., Goldstein, J., Green, S., Marshall, J. S., Thomson, M. A., Xu, B., Casse, G., Vossebeld, J., Coates, T., Salvatore, F., Repond, J., Xia, L., Kenney, C., Tomada, A.

مصطلحات موضوعية: Physics - Instrumentation and Detectors

URL الوصول: http://arxiv.org/abs/1905.02520

المؤلفون: Tant, G., Giry, A., Ferris, P., Pares, G., Arnould, J-D., Fournier, J-M., Raynaud, C., Vincent, P.

المصدر: 2015 IEEE MTT-S International Microwave Symposium Microwave Symposium (IMS), 2015 IEEE MTT-S International. :1-4 May, 2015

Relation: 2015 IEEE MTT-S International Microwave Symposium (IMS2015)

المؤلفون: Bernabe, S., Rida, K., Pares, G., Castany, O., Fowler, D., Kopp, C., Waltener, G., Gonzalez Jimenez, J., Menezo, S.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 6(7):1018-1025 Jul, 2016

المؤلفون: Pares, G., Bouvier, C., Castagne, L., Saadaoui, M., Mazuir, J., Noiray, J., Martinschitz, K., Mercier, L., Planchais, A., Simon, G.

المصدر: 2013 Eurpoean Microelectronics Packaging Conference (EMPC) Microelectronics Packaging Conference (EMPC) , 2013 European. :1-7 Sep, 2013

Relation: 2013 European Microelectronics Packaging Conference (EMPC)

المؤلفون: Luesebrink, H., Pares, G., Attard, A., Schnegg, F., Klug, G.

المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :918-921 May, 2013

Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Pares, G, Bouvier, C., Saadaoui, M., Mazuir, J., Noiray, J., Martinschitz, K., Planchais, A., Simon, G.

المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :304-310 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

المؤلفون: Mazuir, J., Olmeta, V., Yin, M., Pares, G., Planchais, A., Inal, K., Saadaoui, M.

المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :747-751 Dec, 2011

Relation: 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)