يعرض 1 - 10 نتائج من 379 نتيجة بحث عن '"Park, Jin-Goo"', وقت الاستعلام: 1.41s تنقيح النتائج
  1. 1
    مؤتمر
    The Adsorption and Removal of Corrosion Inhibitors During Metal CMP

    المؤلفون: Park, Jin-Goo, Ryu, Heon-Yul, Kim, Tae-Gon, Yerriboina, Nagendra Prasad, Wada, Yutaka, Hamada, Satomi, Hiyama, Hirokuni

    المصدر: 2020 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2020 China. :1-3 Jun, 2020

    Relation: 2020 China Semiconductor Technology International Conference (CSTIC)

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  2. 2
    دورية أكاديمية
    Acoustic power dependent detachment of PSL particles adhered to glass surfaces by dissolved gas and anionic surfactant in an ultrasonic field

    المؤلفون: Sahoo, Bichitra Nanda, Yerriboina, Nagendra Prasad, Kang, Bong-kyun, Klipp, Andreas, Kim, Tae-Gon, Park, Jin-Goo

    المصدر: In Colloids and Surfaces A: Physicochemical and Engineering Aspects 20 August 2023 671

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  3. 3
    دورية أكاديمية
    Benzethonium chloride as a tungsten corrosion inhibitor in neutral and alkaline media for the post-chemical mechanical planarization application

    المؤلفون: Punathil Meethal, Ranjith, Jalalzai, Palwasha, Muskan, Kumar, Sumit, Peter, Jerome, Klipp, Andreas, Kim, Tae-Gon, Park, Jin-Goo

    المصدر: In Journal of Colloid And Interface Science August 2023 643:465-479

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  4. 4
    دورية أكاديمية
    Effect of ammonium halide salts on wet chemical nanoscale etching and polishing of InGaAs surfaces for advanced CMOS devices

    المؤلفون: Samanta, Suprakash, Jin, Seungwan, Lee, Chan-Hee, Lee, Seong-Soo, Struyf, Herbert, Kim, Tae-Gon, Park, Jin-Goo

    المصدر: In Materials Science in Semiconductor Processing July 2023 161

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  5. 5
    مؤتمر
    Removal mechanisms of glass and sapphire materials by slurry free lapping

    المؤلفون: Moon, Deog-Ju, Nagendra Prasad Yerriboina, Si-Hyeong Cho, Sung- Ho Park, Young-Gil Seo, Park, Jin-Goo

    المصدر: 2015 International Conference on Planarization/CMP Technology (ICPT) Planarization/CMP Technology (ICPT), 2015 International Conference on. :1-4 Sep, 2015

    Relation: 2015 International Conference on Planarization/CMP Technology (ICPT)

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  6. 6
    دورية أكاديمية
    Effect of slurry particles on PVA brush contamination during post-CMP cleaning

    المؤلفون: Sahir, Samrina, Cho, Hwi-Won, Jalalzai, Palwasha, Samanta, Suprakash, Hamada, Satomi, Kim, Tae-Gon, Park, Jin-Goo

    المصدر: In Materials Science in Semiconductor Processing 15 November 2022 151

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  7. 7
    مؤتمر
    Investigation of Cu-BTA complex formation and removal on various Cu surface conditions

    المؤلفون: Cho, Byoung-Jun, Park, Jin-Goo, Shima, Shohei, Hamada, Satomi

    المصدر: Proceedings of International Conference on Planarization/CMP Technology 2014 Planarization/CMP Technology (ICPT), 2014 International Conference on. :70-74 Nov, 2014

    Relation: 2014 International Conference on Planarization/CMP Technology (ICPT)

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  8. 8
    مؤتمر
    Effects of pump-induced particle agglomeration during chemical mechanical planarization (CMP)

    المؤلفون: Seo, Young-Gil, Park, Jin-Goo, Elaiyaraju, Periyasamy

    المصدر: Proceedings of International Conference on Planarization/CMP Technology 2014 Planarization/CMP Technology (ICPT), 2014 International Conference on. :254-258 Nov, 2014

    Relation: 2014 International Conference on Planarization/CMP Technology (ICPT)

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  9. 9
    مؤتمر
    The effect of fluid pH for 2-body lapping process

    المؤلفون: Kim, Hyuk-Min, Park, Jin-Goo, Seo, Young-Gil

    المصدر: Proceedings of International Conference on Planarization/CMP Technology 2014 Planarization/CMP Technology (ICPT), 2014 International Conference on. :317-320 Nov, 2014

    Relation: 2014 International Conference on Planarization/CMP Technology (ICPT)

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  10. 10
    دورية أكاديمية
    Theoretical validation of inhibition mechanisms of benzotriazole with copper and cobalt for CMP and post-CMP cleaning applications

    المؤلفون: Ryu, Heon-Yul, Lee, Chi Ho, Lee, Sang Uck, Hamada, Satomi, Yerriboina, Nagendra Prasad, Park, Jin-Goo

    المصدر: In Microelectronic Engineering 1 June 2022 262

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