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1مؤتمر
المؤلفون: Sanchez-Duenas, Leire, Monteserin, Cristina, Gomez, Estibaliz, Blanco, Miren, Larranaga, Mikel, Aranzabe, Estibaliz, Criado-Gonzalez, Miryam, Rai, Rajat, Vilas-Vilela, Jose Luis
المصدر: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2024 IEEE International Conference on. :1-4 Jun, 2024
Relation: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
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2مؤتمر
المؤلفون: Kurnyta, Artur, Leski, Andrzej
المصدر: 2024 11th International Workshop on Metrology for AeroSpace (MetroAeroSpace) Metrology for AeroSpace (MetroAeroSpace), 2024 11th International Workshop on. :112-117 Jun, 2024
Relation: 2024 11th International Workshop on Metrology for AeroSpace (MetroAeroSpace)
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3مؤتمر
المؤلفون: Inoue, Masahiro, Tsujimura, Subaru, Won, Jinseok
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :1-2 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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4دورية أكاديمية
المؤلفون: Zhang, Lei, Tang, Xiaodan, Zhi, Fangfang, Bai, Zhipeng, Wang, Liang, Na, Binbin, Yang, Guohui, Zhang, Jianfeng, Jiang, LinhuaAff1, IDs10973024132844_cor9
المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. :1-17
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5دورية أكاديمية
المؤلفون: Muñoz-Bas, Clara, Muñoz-Tebar, Nuria, Candela-Salvador, Laura, Sayas-Barberá, Estrella, Viuda-Martos, Manuel, Pérez-Alvarez, José Angel, Fernández-López, JuanaAff1, IDs11947023031899_cor7
المصدر: Food and Bioprocess Technology: An International Journal. 17(5):1265-1277
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6دورية أكاديمية
المؤلفون: Fedotov, G. N.Aff1, IDS1028334X2360319X_cor1, Shoba, S. A., Ushkova, D. A., Gorepekin, I. V., Sukharev, A. I., Potapov, D. I.
المصدر: Doklady Earth Sciences. 515(1):453-457
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7دورية أكاديمية
المؤلفون: Jois, Chetan, Chou, Pei-En, Subbarayan, Ganesh
المصدر: Journal of Electronic Materials; Jun2024, Vol. 53 Issue 6, p3070-3077, 8p
مصطلحات موضوعية: SOLDER joints, NONDESTRUCTIVE testing, SOLDER & soldering, TRANSIENTS (Dynamics), ALLOY testing, ELECTRODIFFUSION, SOLDER pastes
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8دورية أكاديمية
المؤلفون: Sorokina, Kristina, Dušek, Karel, Bušek, David
المصدر: Materials (1996-1944); Jun2024, Vol. 17 Issue 11, p2693, 10p
مصطلحات موضوعية: SOLDER & soldering, SHORT circuits, ELECTRICAL engineering, SOLIDIFICATION, SOLDER pastes
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9دورية أكاديمية
المؤلفون: Penghui ZHANG, Maowei ZHANG, Rui WU, Qixiong GU
المصدر: Meikuang Anquan, Vol 55, Iss 6, Pp 100-110 (2024)
مصطلحات موضوعية: inorganic pastes, fire preventing and extinguishing material, corner filling, flow properties, rapid setting properties, strength properties, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
Relation: https://doaj.org/toc/1003-496X
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10مؤتمر
المؤلفون: Nakamichi, Keita, Fukuoka, Hiroshi, Suda, Atsushi, Uwano, Hidetake
المصدر: AIP Conference Proceedings; 2024, Vol. 3086 Issue 1, p1-7, 7p
مصطلحات موضوعية: SLEEVES, TEMPERATURE effect, SOLDER & soldering, MELTING, PRINTED circuits, SOLDER pastes