يعرض 1 - 10 نتائج من 239 نتيجة بحث عن '"Patil, D S"', وقت الاستعلام: 0.99s تنقيح النتائج
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    كتاب إلكتروني

    المؤلفون: Belawadikar, SayaliAff12, Patil, D. S.Aff12, Juneja, AshishAff13

    المساهمون: di Prisco, Marco, Series EditorAff1, Chen, Sheng-Hong, Series EditorAff2, Vayas, Ioannis, Series EditorAff3, Kumar Shukla, Sanjay, Series EditorAff4, Sharma, Anuj, Series EditorAff5, Kumar, Nagesh, Series EditorAff6, Wang, Chien Ming, Series EditorAff7, Patel, Satyajit, editorAff8, Solanki, C. H., editorAff9, Reddy, Krishna R., editorAff10, Shukla, Sanjay Kumar, editorAff11

    المصدر: Proceedings of the Indian Geotechnical Conference 2019 : IGC-2019 Volume II. 134:85-94

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    مؤتمر

    المصدر: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV) Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on. :37-39 Sep, 2014

    Relation: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

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    مؤتمر

    المصدر: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV) Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on. :581-583 Sep, 2014

    Relation: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

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    مؤتمر

    المصدر: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV) Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on. :589-591 Sep, 2014

    Relation: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

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    دورية أكاديمية
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    دورية أكاديمية
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    دورية أكاديمية

    المؤلفون: Kar, R.Aff1, Chand, N., Bute, A.Aff1, Aff3, Maiti, NamitaAff1, Aff3, Rao, A. V. S. S. NarayanAff2, Aff3, Nagar, V.Aff2, Aff3, Shashidhar, R.Aff2, Aff3, Patil, D. S., Ghosh, S. K.Aff2, Aff3, Sharma, A.Aff1, Aff3

    المصدر: Transactions of the Indian National Academy of Engineering: An International Journal of Engineering and Technology. 5(2):327-331