يعرض 1 - 10 نتائج من 76 نتيجة بحث عن '"Paul, Bipul"', وقت الاستعلام: 0.85s تنقيح النتائج
  1. 1
    مؤتمر
    A Physics based MTJ Compact Model for State-of-the-Art and Emerging STT-MRAM Failure Analysis and Yield Enhancement

    المؤلفون: Gaul, Nishtha S., Jaiswal, Akhilesh, Yoon, Hongsik, Lee, Taeyoung, Yamane, Kazutaka, Versaggi, Joe, Carter, Rick, Paul, Bipul C.

    المصدر: 2022 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2022 IEEE International. :1-4 May, 2022

    Relation: 2022 IEEE International Memory Workshop (IMW)

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  2. 2
    كتاب إلكتروني
    Determining Recent Trends of Forest Loss and Its Associated Drivers for Sustainable Management in the Dry Deciduous Forest of West Bengal, India

    المؤلفون: Bera, DipankarAff3, Das Chatterjee, NilanjanaAff3, Bera, SudipAff3, Rana, AkshayAff4, Paul, BipulAff4

    المساهمون: Sahu, Abhay Sankar, editorAff1, Das Chatterjee, Nilanjana, editorAff2

    المصدر: Environmental Management and Sustainability in India : Case Studies from West Bengal. :171-186

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  3. 3
    مؤتمر
    High-speed graphene interconnects monolithically integrated with CMOS ring oscillators operating at 1.3GHz

    المؤلفون: Xiangyu Chen, Kyeong-Jae Lee, Akinwande, Deji, Close, Gael F., Yasuda, Shinichi, Paul, Bipul, Fujita, Shinobu, Jing Kong, Wong, H.-S. Philip

    المصدر: 2009 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2009 IEEE International. :1-4 Dec, 2009

    Relation: 2009 IEEE International Electron Devices Meeting (IEDM)

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  4. 4
    مؤتمر
    Fermi level depinning at metal-organic semiconductor interface for low-resistance Ohmic contacts

    المؤلفون: Liu, Zihong, Kobayashi, Masaharu, Paul, Bipul C., Bao, Zhenan, Nishi, Yoshio

    المصدر: 2009 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2009 IEEE International. :1-4 Dec, 2009

    Relation: 2009 IEEE International Electron Devices Meeting (IEDM)

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  5. 5
    مؤتمر
    A ROM based low-power multiplier

    المؤلفون: Paul, Bipul C., Fujita, Shinobu, Okajima, Masaki

    المصدر: 2008 IEEE Asian Solid-State Circuits Conference Solid-State Circuits Conference, 2008. A-SSCC '08. IEEE Asian. :69-72 Nov, 2008

    Relation: 2008 IEEE Asian Solid-State Circuits Conference (A-SSCC)

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  6. 6
    مؤتمر
    Optimized Circuit Failure Prediction for Aging: Practicality and Promise

    المؤلفون: Agarwal, Mridul, Balakrishnan, Varsha, Bhuyan, Anshuman, Kim, Kyunglok, Paul, Bipul C., Wang, Wenping, Yang, Bo, Cao, Yu, Mitra, Subhasish

    المصدر: 2008 IEEE International Test Conference Test Conference, 2008. ITC 2008. IEEE International. :1-10 Oct, 2008

    Relation: 2008 IEEE International Test Conference (ITC)

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  7. 7
    مؤتمر
    Monolithic integration of CMOS VLSI and CNT for hybrid nanotechnology applications

    المؤلفون: Akinwande, Deji, Yasuda, Shinichi, Paul, Bipul, Fujita, Shinobu, Close, Gael, Wong, H.-S. Philip

    المصدر: ESSDERC 2008 - 38th European Solid-State Device Research Conference Solid-State Device Research Conference, 2008. ESSDERC 2008. 38th European. :91-94 Sep, 2008

    Relation: ESSDERC 2008 - 38th European Solid-State Device Research Conference

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  8. 8
    مؤتمر
    Fault-Tolerant Circuit for Carbon Nanotube Transistors with Si-CMOS Hybrid Circuitry

    المؤلفون: Yasuda, Shinichi, Akinwande, Deji, Close, Gael F., Wong, H.-S. Philip, Paul, Bipul C., Fujita, Shinobu

    المصدر: 2008 8th IEEE Conference on Nanotechnology Nanotechnology, 2008. NANO '08. 8th IEEE Conference on. :684-687 Aug, 2008

    Relation: 2008 8th IEEE Conference on Nanotechnology (NANO)

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  9. 9
    مؤتمر
    Sub-ns Delay Through Multi-Wall Carbon Nanotube Local Interconnects in a CMOS Integrated Circuit

    المؤلفون: Close, Gael F., Yasuda, Shinichi, Paul, Bipul, Fujita, Shinobu, Wong, H.-S. Philip

    المصدر: 2008 International Interconnect Technology Conference Interconnect Technology Conference, 2008. IITC 2008. International. :234-236 Jun, 2008

    Relation: 2008 International Interconnect Technology Conference - IITC

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  10. 10
    مؤتمر
    ROM based logic (RBL) design: High-performance and low-power adders

    المؤلفون: Paul, Bipul C., Shinobu Fujita, Masaki Okajima

    المصدر: 2008 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2008 IEEE International Symposium on. :796-799 May, 2008

    Relation: 2008 IEEE International Symposium on Circuits and Systems (ISCAS)

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