المؤلفون: Malak, M., Pavy, N., Marty, F., Bourouina, T.

المصدر: 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International. :534-537 Jun, 2011

Relation: TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

المؤلفون: Nguyen, K.N, Abi-Saab, D., Malak, M., Basset, P., Richalot, E., Pavy, N., Flourens, F., Marty, F., Angelescu, D., Leprince-Wang, Y., Bourouina, T.

المصدر: 2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2011 Symposium on. :81-84 May, 2011

Relation: 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Malak, M., Pavy, N., Marty, F., Peter, Y.-A., Liu, A.Q., Bourouina, T.

المصدر: 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on. :720-723 Jan, 2011

Relation: 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Viana, C., Tegegne, Z.G., Nanni, J., Tartarini, G., Algani, C., Marty, F., Pavy, N., Polleux, J.

المصدر: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 30(21):1886-1889 Nov, 2018

المؤلفون: Malak, M., Marty, F., Pavy, N., Peter, Y.-A., Liu, A.-Q., Bourouina, T.

المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 21(1):171-180 Feb, 2012

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المؤلفون: Nguyen, K. N., Abi-Saab, D., Basset, P., Richalot, E., Malak, M., Pavy, N., Flourens, F., Marty, F., Angelescu, D., Leprince-Wang, Y., Bourouina, T.

المصدر: Microsystem Technologies: Micro- and NanosystemsInformation Storage and Processing Systems. November 2012 18(11):1807-1814

المؤلفون: Leprince, Yamin, Nguyen, N., Abi-Saab, D., Basset, Philippe, Richalot, Elodie, Malak, M., Pavy, N., Flourens, F., Marty, F., Angelescu, D., Leprince-Wang, Y., Bourouina, Tarik

المساهمون: Mostarshedi, Shermila, Electronique, Systèmes de communication et Microsystèmes (ESYCOM), Conservatoire National des Arts et Métiers [CNAM] (CNAM)-Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris, Institut d’Électronique, de Microélectronique et de Nanotechnologie (IEMN) - UMR 8520 (IEMN), Institut supérieur de l'électronique et du nunérique (ISEN)-Université Polytechnique Hauts-de-France (UPHF)-Ecole Centrale de Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS), Institut d'électronique fondamentale (IEF), Université Paris-Sud - Paris 11 (UP11)-Centre National de la Recherche Scientifique (CNRS), Laboratoire de Physique des Matériaux Divisés et des Interfaces (LPMDI), Université Paris-Est Marne-la-Vallée (UPEM)-Centre National de la Recherche Scientifique (CNRS), Conservatoire National des Arts et Métiers [CNAM] (CNAM), HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris, Université Paris-Est Marne-la-Vallée (UPEM)

المصدر: Microsystem Technologies
Microsystem Technologies, Springer Verlag, 2012, 18 (11), pp.1807-1814. ⟨10.1007/s00542-012-1486-0⟩
Microsystem Technologies, Springer Verlag, 2013, 18 (11), pp.1807-1814

مصطلحات موضوعية: Plasma etching, Materials science, Silicon, Spectrometer, Physics::Instrumentation and Detectors, business.industry, Hybrid silicon laser, Black silicon, chemistry.chemical_element, Condensed Matter Physics, [SPI.TRON] Engineering Sciences [physics]/Electronics, [SPI.TRON]Engineering Sciences [physics]/Electronics, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, Integrating sphere, Optics, chemistry, Hardware and Architecture, Etching (microfabrication), [PHYS.COND.CM-MS]Physics [physics]/Condensed Matter [cond-mat]/Materials Science [cond-mat.mtrl-sci], Electrical and Electronic Engineering, Reactive-ion etching, business, ComputingMilieux_MISCELLANEOUS

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e1fcd630b37af86a780e00909f1d68d2
https://doi.org/10.1007/s00542-012-1486-0

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