يعرض 1 - 10 نتائج من 2,522 نتيجة بحث عن '"Pb-free"', وقت الاستعلام: 1.96s تنقيح النتائج
  1. 1
    مؤتمر
    Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames

    المؤلفون: Martin, Henry, Cao, Xinpei, Wijgaerts, Jan, Smits, Edsger, Xia, Bo, de Wit, Ruud

    المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-8 Sep, 2023

    Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  2. 2
    دورية أكاديمية
    Thermomechanical Reliabilities of Pb-Free Solder Joints According to Ag Content in Harsh Environment

    المؤلفون: Kim, J., Yoon, D.

    المصدر: IEEE Transactions on Reliability IEEE Trans. Rel. Reliability, IEEE Transactions on. 72(4):1610-1618 Dec, 2023

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  3. 3
    مؤتمر
    Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys

    المؤلفون: Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya, Nogita, Kazuhiro

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :81-82 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  4. 4
    مؤتمر
    In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface

    المؤلفون: Nogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi, Matsumura, Syo

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :215-216 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  5. 5
    مؤتمر
    Lead-Free Diffusion Bonding for High Temperature Using ZnAl Eutectic Alloy

    المؤلفون: Ikeda, Toru, Kurakazu, Tomoki, Koganemaru, Masaaki, Nishimura, Tetsuro

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :99-100 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  6. 6
    دورية أكاديمية
    Large Strain with Small Hysteresis at High Temperature of Bi0.5Na0.5TiO3-Bi0.5K0.5TiO3-BaZrO3 Lead-Free Piezoelectric Ceramic

    المؤلفون: Dinh, Thi HinhAff1, IDs11665024097869_cor1, Tran, Vu Diem Ngoc, Van Le, Vinh, Nguyen, Thi Thao

    المصدر: Journal of Materials Engineering and Performance. :1-8

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  7. 7
    دورية أكاديمية
    Exploring Efficiency Improvement by Introducing Ge in CsSnI3 Perovskite Solar Cells: Computational Approach

    المؤلفون: Samanta, Atanu, Kumar, VijayAff2, Aff3, Kanjilal, AlokeAff1, IDs1166402411164z_cor3

    المصدر: Journal of Electronic Materials. 53(7):4272-4286

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  8. 8
    دورية أكاديمية
    Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys

    المؤلفون: Eid, E. A.Aff1, IDs10973024130186_cor1, Fawzy, A., Mansour, M. M., Saad, G., Amin, M.

    المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 149(10):4313-4331

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  9. 9
    دورية أكاديمية
    Exploring the optoelectronic properties of novel lead-free double halide perovskites Cs2NaInX6 (X = Br, Cl, I) for photovoltaic applications: DFT study

    المؤلفون: Jebari, H.Aff1, IDs43207024003959_cor1, Hamideddine, I., Ez-Zahraouy, H.

    المصدر: Journal of the Korean Ceramic Society: 한국세라믹학회지. :1-6

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  10. 10
    دورية أكاديمية
    Microstructure Evolution and Shear Strength Study of Sn–9Zn and Sn–8Zn–3Bi on Cu Substrate

    المؤلفون: Mayappan, RamaniAff1, IDs42341023004815_cor1, Ahmad, Zainal Arifin

    المصدر: Transactions on Electrical and Electronic Materials. 25(1):48-58

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