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المؤلفون: A. Tissier, A. Blosse, N. Brun, Ph. Normandon
المصدر: Applied Surface Science. 73:14-18
مصطلحات موضوعية: Materials science, business.industry, Process (computing), Oxide, General Physics and Astronomy, chemistry.chemical_element, Nanotechnology, Surfaces and Interfaces, General Chemistry, Condensed Matter Physics, Salicide, Surfaces, Coatings and Films, chemistry.chemical_compound, CMOS, chemistry, Optoelectronics, Process window, Wafer, Sensitivity (control systems), business, Titanium
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المؤلفون: P. Vannier, Ph. Normandon, E. Petitprez, V. Caubet-Hilloutou, J. Guillan, K. Haxaire, D. Bellet, M. Mellier, P. Caubet, O. Dubreuil
المساهمون: Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), STMicroelectronics [Crolles] (ST-CROLLES), Laboratoire Interdisciplinaire Solidarités, Sociétés, Territoires (LISST), École des hautes études en sciences sociales (EHESS)-Université Toulouse - Jean Jaurès (UT2J)-École Nationale Supérieure de Formation de l'Enseignement Agricole de Toulouse-Auzeville (ENSFEA)-Centre National de la Recherche Scientifique (CNRS), Laboratoire des matériaux et du génie physique (LMGP ), Institut National Polytechnique de Grenoble (INPG)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS), École des hautes études en sciences sociales (EHESS)-Université Toulouse - Jean Jaurès (UT2J), Université de Toulouse (UT)-Université de Toulouse (UT)-École Nationale Supérieure de Formation de l'Enseignement Agricole de Toulouse-Auzeville (ENSFEA)-Centre National de la Recherche Scientifique (CNRS), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut National Polytechnique de Grenoble (INPG)-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS)
المصدر: Microelectronic Engineering
Microelectronic Engineering, Elsevier, 2010, 87 (3), pp.421-425. ⟨10.1016/j.mee.2009.07.002⟩
Microelectronic Engineering, 2010, 87 (3), pp.421-425. ⟨10.1016/j.mee.2009.07.002⟩مصطلحات موضوعية: Materials science, Annealing (metallurgy), Copper interconnect, Polishing, chemistry.chemical_element, 02 engineering and technology, 01 natural sciences, Chemical-mechanical planarization, 0103 physical sciences, Copper plating, Electrical and Electronic Engineering, ComputingMilieux_MISCELLANEOUS, 010302 applied physics, Metallurgy, [CHIM.MATE]Chemical Sciences/Material chemistry, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Copper, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Grain growth, Overburden, chemistry, 13. Climate action, 0210 nano-technology
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المؤلفون: Ph. Normandon, G. Lormand, F. Jeuland, A. Boudou
المصدر: Quality and Reliability Engineering. 8:247-251
مصطلحات موضوعية: Temperature control, Materials science, Acceleration factor, Acceleration coefficient, Electronic engineering, Wafer, Activation energy, Management Science and Operations Research, Safety, Risk, Reliability and Quality, Electromigration, Current density, Standard deviation, Computational physics
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المؤلفون: J.C. Oberlin, Ph. Lami, Ph. Normandon
المصدر: Applied Surface Science. 53:69-73
مصطلحات موضوعية: Materials science, Bilayer, Oxide, Nucleation, General Physics and Astronomy, Nanotechnology, Surfaces and Interfaces, General Chemistry, Chemical vapor deposition, Adhesion, Condensed Matter Physics, Surfaces, Coatings and Films, Amorphous solid, Stress (mechanics), chemistry.chemical_compound, chemistry, Silicide, Composite material
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المؤلفون: A. Poncet, F. Jeuland, G. Lormand, Ph. Normandon, A. Boudou
المصدر: 1991 Proceedings Eighth International IEEE VLSI Multilevel Interconnection Conference.
مصطلحات موضوعية: Materials science, Condensed matter physics, Line (geometry), Thermal, Electronic engineering, Thermal effect, Current density, Electromigration, Electrical conductor, Grain size, Material flow
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9d0373e076413476ce6a1bf735ceb68b
https://doi.org/10.1109/vmic.1991.153037 -
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المؤلفون: M. Dupeux, M. Ignat, J.J. Bacmann, L. Maniguet, Ph. Normandon
المصدر: MRS Proceedings. 338
مصطلحات موضوعية: Diffraction, Materials science, Passivation, business.industry, chemistry.chemical_element, Tungsten, Metal, Stress (mechanics), Optics, chemistry, visual_art, X-ray crystallography, Perpendicular, visual_art.visual_art_medium, Composite material, business, Line (formation)
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المؤلفون: L. Maniguet, M. Dupeux, M. Ignat, Ph. Normandon, J.J. Bacmann
المصدر: MRS Proceedings. 309
مصطلحات موضوعية: Diffraction, Stress (mechanics), Materials science, chemistry, Residual stress, Metallurgy, X-ray, chemistry.chemical_element, Tungsten, Edge (geometry), Composite material, Line width, Line (formation)
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المؤلفون: François Templier, Ph. Normandon, Joaquim Torres, M. Ignat, L. Fayette
المصدر: MRS Proceedings. 264
مصطلحات موضوعية: chemistry.chemical_classification, Chromium, Materials science, chemistry, Scanning electron microscope, Polymer substrate, chemistry.chemical_element, Substrate (electronics), Polymer, Adhesion, Composite material, Deformation (engineering), Copper
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المؤلفون: R. Pantel, N. Brun, J. Donnelly, Ph. Normandon
المصدر: MRS Proceedings. 260
مصطلحات موضوعية: chemistry.chemical_compound, Auger electron spectroscopy, Range (particle radiation), Materials science, chemistry, Scanning electron microscope, Microscopy, Oxide, Substrate (electronics), Composite material, Sheet resistance, Deposition (law)
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المؤلفون: Ph. Normandon, M. Ignat, A. Chouaf
المصدر: MRS Proceedings. 188
مصطلحات موضوعية: Materials science, Silicon, chemistry, Stress relaxation, chemistry.chemical_element, Substrate (electronics), Adhesion, Experimental methods, Composite material, Tungsten, Internal stress
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