المؤلفون: Khan, N., Yu, L. H., Pin, T. S., Ho, S. W., Kripesh, V., Pinjala, D., Lau, J. H., Chuan, T. K.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(2):221-228 Feb, 2013