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1دورية أكاديمية
المؤلفون: Yasmeen Hameed Abd, Ikhlase M. Fayed
المصدر: Journal of Engineering, Vol 13, Iss 02 (2024)
مصطلحات موضوعية: Square Plate, Circular Hole, Natural Convection, Three-Dimensional, Engineering (General). Civil engineering (General), TA1-2040
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Heinzlmeier, L.Aff1, Aff2, IDs11340023009569_cor1, Sieberer, S., Kralovec, C., Schagerl, M.Aff1, Aff2
المصدر: Experimental Mechanics: An International Journal Integrating Experimental Methods with the Mechanical Behavior of Materials and Structures. :1-13
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3دورية أكاديمية
المؤلفون: Jalalinia, Mohammadreza, Amiri, Gholamreza GhodratiAff1, IDs42417022006229_cor2, Razzaghi, Seyed Ali Seyed
المصدر: Journal of Vibration Engineering & Technologies. 11(3):1029-1046
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4دورية أكاديمية
المؤلفون: Kozhevnikov, I. V., Bologa, M. K.Aff1, IDS1068375522060102_cor2
المصدر: Surface Engineering and Applied Electrochemistry. 58(6):638-656
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5دورية أكاديمية
المؤلفون: Jalalinia, Mohammadreza, Amiri, Gholamreza GhodratiAff1, IDs4099602200823y_cor2, Razzaghi, Seyed Ali Seyed
المصدر: Iranian Journal of Science and Technology, Transactions of Civil Engineering. 46(5):3765-3787
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6كتاب إلكتروني
المؤلفون: Satish, JajulaAff5, Sanyal, ShubhashisAff5, Bhowmick, ShubhankarAff5
المساهمون: Narasimham, G. S. V. L., editorAff1, Babu, A. Veeresh, editorAff2, Reddy, S. Sreenatha, editorAff3, Dhanasekaran, Rajagopal, editorAff4
المصدر: Recent Trends in Mechanical Engineering : Select Proceedings of ICIME 2019. :641-648
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7مؤتمر
المؤلفون: Park, Nochang, Kim, Jiho, Oh, Chulmin, Han, Changwoon, Song, Byungsuk, Hong, Wonsik
المصدر: 2009 European Microelectronics and Packaging Conference Microelectronics and Packaging Conference, 2009. EMPC 2009. European. :1-4 Jun, 2009
Relation: 2009 European Microelectronics and Packaging Conference (EMPC)
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8دورية أكاديمية
المؤلفون: Seongsik Lim, Vivek Kumar Dhimole, Yongbae Kim, Chongdu Cho
المصدر: Polymers, Vol 14, Iss 10, p 1977 (2022)
مصطلحات موضوعية: plate with hole, carbon/epoxy polymer, braided composites, finite element analysis, stress behavior, stress concentration factor (SCF), Organic chemistry, QD241-441
وصف الملف: electronic resource
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9كتاب إلكتروني
المؤلفون: Makki, Mhalla MohamedAff13, Chokri, BouraouiAff13
المساهمون: Haddar, Mohamed, Series editorAff1, Aff5, Bartelmus, Walter, Series editorAff2, Chaari, Fakher, Series editorAff3, Aff12, Zimroz, Radoslaw, Series editorAff4, Abbes, Mohamed Slim, editorAff6, Choley, Jean-Yves, editorAff7, Boukharouba, Taoufik, editorAff8, Elnady, Tamer, editorAff9, Kanaev, Andrei, editorAff10, Ben Amar, Mounir, editorAff11
المصدر: Multiphysics Modelling and Simulation for Systems Design and Monitoring : Proceedings of the Multiphysics Modelling and Simulation for Systems Design Conference, MMSSD 2014, 17-19 December, Sousse, Tunisia. 2:517-530
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10
المؤلفون: Heinzlmeier, L., Sieberer, S., Kralovec, C., Schagerl, M.
مصطلحات موضوعية: Tension-tension loading, Digital image correlation, CFRP, Plain-woven composites, Plate with hole, Fatigue
وصف الملف: text/html
URL الوصول: https://explore.openaire.eu/search/publication?articleId=od______3361::c0a8e5b6364ace6bb0bbcb95b3cf6609
https://epub.jku.at/doi/10.1007/s11340-023-00956-9