يعرض 1 - 10 نتائج من 20 نتيجة بحث عن '"Podpod, Arnita"', وقت الاستعلام: 1.30s تنقيح النتائج
  1. 1
    مؤتمر
    Collective die-to-wafer assembly process for optically interconnected System-on-wafer

    المؤلفون: Kennes, Koen, Dvoretskii, Anton, Podpod, Arnita, Xu, Pengfei, He, Junwen, Lepage, Guy, Golshani, Negin, Verheyen, Peter, Magdziak, Rafal, Bipul, Swetanshu, Phommahaxay, Alain, Chakrabarti, Maumita, Miller, Andy, Beyne, Eric, Ban, Yoojin, Ferraro, Filippo, van Campenhout, Joris

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1392-1397 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer

    المؤلفون: Xu, Pengfei, He, Junwen, Kennes, Koen, Dvoretskii, Anton, Podpod, Arnita, Lepage, Guy, Golshani, Negin, Magdziak, Rafal, Bipul, Swetanshu, Bode, Dieter, Verheyen, Peter, Chakrabarti, Maumita, Velenis, Dimitrios, Miller, Andy, Ban, Yoojin, Ferraro, Filippo, Van Campenhout, Joris

    المصدر: 2024 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2024. :1-3 Mar, 2024

    Relation: 2024 Optical Fiber Communications Conference and Exhibition (OFC)

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  3. 3
    مؤتمر
    Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics

    المؤلفون: Van Asch, Jef, Missinne, Jeroen, He, Junwen, Xu, Pengfei, Podpod, Arnita, Lepage, Guy, Golshani, Negin, Magdziak, Rafal, Sar, Huseyin, Kobbi, Hakim, Bipul, Swetanshu, Bode, Dieter, Ban, Yoojin, Ferraro, Filippo, Van Campenhout, Joris, Van Steenberge, Geert

    المصدر: 2024 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2024. :1-3 Mar, 2024

    Relation: 2024 Optical Fiber Communications Conference and Exhibition (OFC)

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  4. 4
    مؤتمر
    The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics

    المؤلفون: Phommahaxay, Alain, Kennes, Koen, Podpod, Arnita, Brems, Steven, Slabbekoorn, John, Sleeckx, Erik, Huyghebaert, Cedric, Asselberghs, Inge, Miller, Andy, Beyer, Gerald, Radu, Iuliana, Beyne, Eric, Guerrero, Alice, Prenger, Luke, Yess, Kim, Arnold, Kim, Tussing, Sebastian, Spiess, Walter, Rapps, Thomas, Lutter, Stefan

    المصدر: 2019 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2019 International. :1-8 Oct, 2019

    Relation: 2019 International Wafer Level Packaging Conference (IWLPC)

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  5. 5
    مؤتمر
    Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift

    المؤلفون: Podpod, Arnita, Phommahaxay, Alain, Bex, Pieter, Kennes, Koen, Bertheau, Julien, Arumugam, Hariharan, Cochet, Tom, Rebibis, Kenneth, Sleeckx, Erick, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Liu, Xiao, Wu, Qi, Yess, Kim, Arnold, Kim

    المصدر: 2019 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2019 International. :1-6 Oct, 2019

    Relation: 2019 International Wafer Level Packaging Conference (IWLPC)

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  6. 6
    مؤتمر
    Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding

    المؤلفون: Inoue, Fumihiro, Phommahaxay, Alain, Podpod, Arnita, Suhard, Samuel, Hoshino, Hitoshi, Moeller, Berthold, Sleeckx, Erik, June Rebibis, Kenneth, Miller, Andy, Beyne, Eric

    المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :437-445 May, 2019

    Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up

    المؤلفون: Podpod, Arnita, Phommahaxay, Alain, Bex, Pieter, Slabbekoorn, John, Bertheau, Julien, Salahoueldhadj, Abdellah, Sleeckx, Erik, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Yess, Kim, Arnold, Kim

    المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :340-345 May, 2019

    Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits

    المؤلفون: Marinissen, Erik Jan, Fodor, Ferenc, Podpod, Arnita, Stucchi, Michele, Jian, Yu-Rong, Wu, Cheng-Wen

    المصدر: 2018 IEEE International Test Conference (ITC) International Test Conference (ITC), 2018 IEEE. :1-10 Oct, 2018

    Relation: 2018 IEEE International Test Conference (ITC)

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  9. 9
    مؤتمر
    A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch

    المؤلفون: Podpod, Arnita, Slabbekoorn, John, Phommahaxay, Alain, Duval, Fabrice, Salahouelhadj, Abdellah, Gonzalez, Mario, Rebibis, Kenneth, Miller, Andy, Beyer, Gerald, Beyne, Eric

    المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :370-378 May, 2018

    Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-up

    المؤلفون: Phommahaxay, Alain, Podpod, Arnita, Slabbekoorn, John, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Bai, Dongshun, Arnold, Kim

    المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :985-992 May, 2018

    Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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