المؤلفون: Ghosh, Saptarsi, Frentrup, Martin, Hinz, Alexander M., Pomeroy, James W., Field, Daniel, Wallis, David J., Kuball, Martin, Oliver, Rachel A.

مصطلحات موضوعية: Physics - Applied Physics, Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/2407.09723

المؤلفون: Jindal, Gautam, Pomeroy, James W., Watkins, Gavin T., Morris, Kevin, Kuball, Martin, Cappello, Tommaso

المصدر: 2022 International Workshop on Integrated Nonlinear Microwave and Millimetre-Wave Circuits (INMMiC) Integrated Nonlinear Microwave and Millimetre-Wave Circuits (INMMiC), 2022 International Workshop on. :1-3 Apr, 2022

Relation: 2022 International Workshop on Integrated Nonlinear Microwave and Millimetre-Wave Circuits (INMMiC)

المؤلفون: Mishra, Abhishek, Abdallah, Zeina, Kim, Hyun-Seop, Pomeroy, James W., Uren, Michael J., Kuball, Martin

المصدر: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :390-392 Mar, 2022

Relation: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Kuball, Martin, Pomeroy, James W., Gucmann, Filip, Oner, Bahar

المصدر: 2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS) BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2019 IEEE. :1-5 Nov, 2019

Relation: 2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS)

المؤلفون: Pomeroy, James W., Leide, Alex, Mowat, Miriam, Kuball, Martin, Davies, Mark, Jordan, Matthew S.L., Tzelepi, Athanasia, Goddard, Dave T., Liu, Dong

المصدر: In Journal of the European Ceramic Society June 2024 44(6):3696-3704

المؤلفون: Yuan, Chao, Pomeroy, James W., Kuball, Martin

المصدر: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018 17th IEEE Intersociety Conference on. :256-261 May, 2018

Relation: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Kuball, Martin, Pomeroy, James W.

المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :18-18 Oct, 2021

Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

المؤلفون: Pomeroy, James W., Simon, Roland B., Middleton, Callum, Kuball, Martin

المصدر: 2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) Compound Semiconductor Integrated Circuit Symposium (CSICS), 2017 IEEE. :1-4 Oct, 2017

Relation: 2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

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المؤلفون: Mandal, Soumen, Cuenca, Jerome, Massabuau, Fabien, Yuan, Chao, Bland, Henry, Pomeroy, James W., Wallis, David, Batten, Tim, Morgan, David, Oliver, Rachel, Kuball, Martin, Williams, Oliver A.

مصطلحات موضوعية: Physics - Applied Physics, Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/1907.02481