المؤلفون: Malik, N., Schjolberg-Henriksen, K., Poppe, E., Finstad, T. G.

المصدر: 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII) Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on. :1067-1070 Jun, 2013

Relation: 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)

المؤلفون: Midtbo, K., Ronnekleiv, A., Ingebrigtsen, K. A., Due-Hansen, J., Poppe, E., Wang, D. T., Jensen, G. U., Schjolberg-Henriksen, K.

المصدر: 2012 IEEE Sensors Sensors, 2012 IEEE. :1-5 Oct, 2012

Relation: 2012 IEEE Sensors

المؤلفون: Taklo, M.M. Visser, Schjolberg-Henriksen, K., Malik, N., Poppe, E., Moe, S.T., Finstad, T.G.

المصدر: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2017 5th International Workshop on. :11-11 May, 2017

Relation: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

المؤلفون: Palosaari, J., Juuti, J., Tyholdt, F., Ostbo, N.P., Vogl, A., Poppe, E., Gudbjornsson, S., Ringgaard, E., Hok, B., Fagerman, P.-E., Gloersen, P., Raeder, H., Jantunen, H.

المصدر: 2009 IEEE International Ultrasonics Symposium Ultrasonics Symposium (IUS), 2009 IEEE International. :1734-1737 Sep, 2009

Relation: 2009 IEEE International Ultrasonics Symposium

المؤلفون: Poppe, E., Ostbo, N. P., Booij, W., Tyholdt, F., Calame, F., Hok, B., Jensen, F., Raeder, H., Muralt, P.

المصدر: TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International. :529-532 Jun, 2007

Relation: TRANSDUCERS 2007 - International Solid-State Sensors, Actuators and Microsystems Conference

المؤلفون: Taklo, M.M.V., Schjolberg-Henriksen, K., Malik, N., Tofteberg, H.R., Poppe, E., Vella, D.O., Borg, J., Attard, A., Hajdarevic, Z., Klumpp, A., Ramm, P.

المصدر: 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on. :34-34 Jul, 2014

Relation: 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

المؤلفون: Wynn, M.T., Poppe, E., Xu, J., ter Hofstede, A.H.M., Brown, R., Pini, A., van der Aalst, W.M.P.

المصدر: In Decision Support Systems August 2017 100:93-108

المؤلفون: Poppe, E., Srinivasan, B., Jain, R.

المصدر: Technical Digest. Summaries of Papers Presented at the Conference on Lasers and Electro-Optics. Conference Edition. 1998 Technical Digest Series, Vol.6 (IEEE Cat. No.98CH36178) Laser and electro-optics Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on. :80-81 1998

Relation: Technical Digest Summaries of papers presented at the Conference on Lasers and Electro-Optics Conference Edition. 1998 Technical Digest Series, Vol.6

المؤلفون: Srinivasan, B., Poppe, E., Jain, R.K.

المصدر: Technical Digest. Summaries of Papers Presented at the Conference on Lasers and Electro-Optics. Conference Edition. 1998 Technical Digest Series, Vol.6 (IEEE Cat. No.98CH36178) Laser and electro-optics Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on. :297 1998

Relation: Technical Digest Summaries of papers presented at the Conference on Lasers and Electro-Optics Conference Edition. 1998 Technical Digest Series, Vol.6

المؤلفون: Malik, N., Schjølberg-Henriksen, K., Poppe, E., Taklo, M.M.Visser, Finstad, T.G.

المصدر: In Sensors & Actuators: A. Physical 1 May 2014 211:115-120