المؤلفون: Derakhshandeh, J., De Preter, I., Gerets, C., Hou, L., Heylen, N., Beyne, E., Beyer, G., Slabbekoorn, J., Dubey, V., Jourdain, A., Potoms, G., Inoue, F., Jamieson, G., Vandersmissen, K., Suhard, S., Webers, T., Capuz, G., Wang, T., Rebibis, K.J., Miller, A.

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :128-133 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

المؤلفون: Potoms, G., Teng, W., Derakhshandeh, J., Daily, R., Capuz, G., Gonzalez, M., Beyer, G., Rebibis, K.J., Miller, R. A., Beyne, E.

المصدر: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th. :313-317 Dec, 2014

Relation: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Popovici, M., Belmonte, A., Oh, H., Potoms, G., Meersschaut, J., Richard, O., Hody, H., Van Elshocht, S., Delhougne, R., Goux, L., Kar, G. Sankar

المصدر: 2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :2.7.1-2.7.4 Dec, 2018

Relation: 2018 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Florent, K., Pesic, M., Subirats, A., Banerjee, K., Lavizzari, S., Arreghini, A., Di Piazza, L., Potoms, G., Sebaai, F., McMitchell, S. R. C., Popovici, M., Groeseneken, G., Van Houdt, J.

المصدر: 2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :2.5.1-2.5.4 Dec, 2018

Relation: 2018 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Florent, K., Lavizzari, S., Di Piazza, L., Popovici, M., Vecchio, E., Potoms, G., Groeseneken, G., Van IHoudt, J.

المصدر: 2017 Symposium on VLSI Technology VLSI Technology, 2017 Symposium on. :T158-T159 Jun, 2017

Relation: 2017 Symposium on VLSI Technology

المؤلفون: Buisson, T., Potoms, G., Phommahaxay, A., Verbinnen, G., Jaenen, P., La Manna, A., Travaly, Y., Beyne, E.

المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :25-28 Dec, 2011

Relation: 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

المؤلفون: Soussan, P., Goux, L., Dehan, M., Vander Meeren, H., Potoms, G., Wouters, D.J., Beyne, E.

المصدر: 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :5 pp. 2006

Relation: 2006 Proceedings. 56th Electronic Components & Technology Conference

المؤلفون: Detalle, M., Barrenetxea, M., Muller, P., Potoms, G., Phommahaxay, A., Soussan, P., Vaesen, K., De Raedt, W.

المصدر: In Microelectronic Engineering 2010 87(12):2571-2576

المؤلفون: Garbin, D., Ravsher, T., Devulder, W., Clima, S., Potoms, G., Belmonte, A., Kar, G.S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. PP(99):1-6

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