المؤلفون: Liu, Jiahao, Han, Lu, Zhong, Xiangxiang, Diao, He, Wang, Fengyi, Chen, Fangzhou, Sun, Zhaoning, Chen, Hongtao, Zhao, Hao

المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Guo, Xinnuo, Su, Dazhi, Zeng, Fuping, Chen, Rirong, Zhong, Hengxin, Yao, Qiang, Deng, Baojia, Tang, Ju

المصدر: 2024 IEEE 5th International Conference on Dielectrics (ICD) Dielectrics (ICD), 2024 IEEE 5th International Conference on. :1-4 Jun, 2024

Relation: 2024 IEEE 5th International Conference on Dielectrics (ICD)

المؤلفون: Chen, Chuantong, Sekiguchi, Takuya, Suganuma, Katsuaki

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :79-80 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Won, Mi So, Kim, Dajung, Yang, Hyunseung, Oh, Chulmin

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :327-328 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Ahmed, Salahaldein, Lai, Pengyu, Chinnaiyan, Sudharsan, Mantooth, Alan, Chen, Zhong

المصدر: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2023 IEEE. :2588-2595 Mar, 2023

Relation: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC)

المؤلفون: Huang, Wei-Chen, Tsai, Chin-Hao, Kao, C. R.

المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :326-329 Sep, 2022

Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

المؤلفون: Liu, J., Mou, Y., Peng, Y., Chen, M.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(5):878-882 May, 2022

المؤلفون: Hou, Juncai, Li, Chengxin, Huang, Sijie, Nishikawa, Hiroshi

المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :432-436 Apr, 2019

Relation: 2019 International Conference on Electronics Packaging (ICEP)

المؤلفون: Salahaldein Ahmed, Pengyu Lai, Sudharsan Chinnaiyan, Alan Mantooth, Zhong Chen

المصدر: e-Prime: Advances in Electrical Engineering, Electronics and Energy, Vol 7, Iss , Pp 100412- (2024)

مصطلحات موضوعية: High-temperature (HT) gate driver, Power module, Power device packaging, High-temperature applications, Silicon carbide MOSFET, BJT, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2772671123003078; https://doaj.org/toc/2772-6711

URL الوصول: https://doaj.org/article/c1d95a37e46d4234a868593988cd2516

المؤلفون: Seong, Kyeongsool, Iwasaki, Toshihiro, Nakamura, Takashi, Sakumoto, Shotaro, Taniguchi, Fumihiko

المصدر: 2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :341-344 Apr, 2017

Relation: 2017 International Conference on Electronics Packaging (ICEP)