المؤلفون: van Driel, W. D.^{Aff4, Aff5}, Pressel, K.^Aff6, Soyturk, M.^Aff7

المساهمون: van Driel, Willem Dirk, editor^Aff1, Pressel, Klaus, editor^Aff2, Soyturk, Mujdat, editor^Aff3

المصدر: Recent Advances in Microelectronics Reliability : Contributions from the European ECSEL JU project iRel40. :1-7

المؤلفون: van Driel, W. D.^{Aff4, Aff5}, Pressel, K.^Aff6, Soyturk, M.^Aff7, Knoll, H.^Aff8, Hille, P.^Aff8

المساهمون: van Driel, Willem Dirk, editor^Aff1, Pressel, Klaus, editor^Aff2, Soyturk, Mujdat, editor^Aff3

المصدر: Recent Advances in Microelectronics Reliability : Contributions from the European ECSEL JU project iRel40. :385-399

المؤلفون: Fruehauf, P., Munding, A., Pressel, K., Schwarz, P., Vogt, M.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(1):44-56 Jan, 2020

المؤلفون: Caldwell, PM, Terai, CR, Hillman, B, Keen, ND, Bogenschutz, P, Lin, W, Beydoun, H, Taylor, M, Bertagna, L, Bradley, AM, Clevenger, TC, Donahue, AS, Eldred, C, Foucar, J, Golaz, J‐C, Guba, O, Jacob, R, Johnson, J, Krishna, J, Liu, W, Pressel, K, Salinger, AG, Singh, B, Steyer, A, Ullrich, P, Wu, D, Yuan, X, Shpund, J, Ma, H‐Y, Zender, CS

المصدر: Journal of Advances in Modeling Earth Systems. 13(11)

مصطلحات موضوعية: Earth Sciences, Oceanography, Atmospheric Sciences, Climate Action, cloud resolving model, storm resolving model, general circulation model, convection permitting model, E3SM, Atmospheric sciences, Geoinformatics

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/60s851gh
https://escholarship.org/content/qt60s851gh/qt60s851gh.pdf

المؤلفون: Munding, A., Gruber, M., Pressel, K., Plikat, B., Vogt, M., Fruehauf, P.

المصدر: 2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :1-7 Sep, 2018

Relation: 2018 7th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Klingert, F., Roeder, G., Schellenberger, M., Bauer, A., Frey, L., Brueggemann, M., Pressel, K.

المصدر: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2017 28th Annual SEMI. :72-77 May, 2017

Relation: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

المؤلفون: Hagelauer, A., Wojnowski, M., Pressel, K., Weigel, R., Kissinger, D.

المصدر: IEEE Microwave Magazine IEEE Microwave Microwave Magazine, IEEE. 19(1):48-56 Jan, 2018

المؤلفون: Charbonnier, J., Assous, M., Bally, J.P., Plihon, A., Hilt, T., Hassaine, A., Mourier, T., Manquat, C. Brunet, Franiatte, R., Guillaume, J., Hartler, C., Siegert, J., Schrank, F., Pressel, K., Gruber, H.

المصدر: 2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-7 Sep, 2016

Relation: 2016 6th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Issakov, V., Wojnowski, M., Knapp, H., Trotta, S., Forstner, H.-P., Pressel, K., Hagelauer, A.

المصدر: 2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2016 IEEE. :94-101 Sep, 2016

Relation: 2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - BCTM

المؤلفون: Heilmann, J., Nikitin, I., Zschenderlein, U., May, D., Pressel, K., Wunderle, B.

المصدر: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on. :1-13 Apr, 2016

Relation: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)