المؤلفون: Rodrigues, Augusto, Roshanghias, Ali

المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-4 May, 2023

Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

المؤلفون: Hu, X., Martina, H.A., Poelma, R.H., Huang, J.L., Rijckevorsel, H., Scholten, H., Smits, E.C.P., Van Driel, W.D., Zhang, G.Q.

المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-7 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Desai, Vyom^{Aff1, Aff2, IDs11665024095134_cor1}, Shrivastava, Aroh^{Aff1, Aff2}, Zala, Arunsinh B., Parekh, Tejas, Gupta, Surojit, Jamnapara, N. I.^{Aff1, Aff2}

المصدر: Journal of Materials Engineering and Performance. :1-9

المؤلفون: Chen, Yaning^{Aff1, Aff2}, Sun, Zhiping^{Aff1, Aff2, IDs4357802401302y_cor2}, Wang, Zhiming^{Aff1, Aff2}, Zhao, Wenkai^{Aff1, Aff2}, Shang, Zhiwei^{Aff1, Aff2}

المصدر: Journal of Materials Research. 39(7):1181-1196

المؤلفون: Alireza Zibanejad-rad, Ali Alizadeh, Seyyed Mehdi Abbasi

المصدر: Iranian Journal of Materials Science and Engineering, Vol 21, Iss 2, Pp 1-14 (2024)

مصطلحات موضوعية: pressureless sintering, titanium, composite, microstructure, wear, Technology

وصف الملف: electronic resource

Relation: http://ijmse.iust.ac.ir/article-1-3493-en.pdf; https://doaj.org/toc/1735-0808; https://doaj.org/toc/2383-3882

URL الوصول: https://doaj.org/article/ad493182a18f458ebfeb3851b3aca8cd

المؤلفون: Zhang, X., Zhao, X., Li, W., Wang, Z., Liao, A., Song, Y., Wang, Y., Zhang, L.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(2):188-196 Feb, 2023

المؤلفون: Chen, Zehao, Huang, Shijun, Li, Cai-Fu

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Wang, Yan, Yang, Liang, Han, Taiping, Hu, Deming, Chen, Kun, Xie, An, Cao, Chunyan, Shu, Xiayun

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Shen, Xingwang, Xi, Shuang, Li, Junjie, Xu, Liang, Sun, Rong

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Gao, Lilan, Tian, Xinwei, Wu, Chengjin, Xing, Yulong, Tan, Yansong, Chen, Xu, Lu, Guoquan

المصدر: 2022 IEEE International Conference on Mechatronics and Automation (ICMA) Mechatronics and Automation (ICMA), 2022 IEEE International Conference on. :1452-1456 Aug, 2022

Relation: 2022 IEEE International Conference on Mechatronics and Automation (ICMA)