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1مؤتمر
المؤلفون: Li, Jamy, Penaranda, Karen
المصدر: 2024 IEEE 4th International Conference on Human-Machine Systems (ICHMS) Human-Machine Systems (ICHMS), 2024 IEEE 4th International Conference on. :1-7 May, 2024
Relation: 2024 IEEE 4th International Conference on Human-Machine Systems (ICHMS)
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2مؤتمر
المؤلفون: Sanford, Caitlyn, Valley, Sarah, Keegan, Kaylee, Foote, Reed, Cherbaka, Natalie
المصدر: 2024 Systems and Information Engineering Design Symposium (SIEDS) Systems and Information Engineering Design Symposium (SIEDS), 2024. :487-492 May, 2024
Relation: 2024 Systems and Information Engineering Design Symposium (SIEDS)
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3مؤتمر
المؤلفون: Holloman, Isabella, Campbell, Austin, Pavuluru, Neha, Darquea, Sergio, Lawrence, Gabriel A, Bolton, Matthew L., Rose, Olivia Claire, Miller, Michael A.
المصدر: 2024 Systems and Information Engineering Design Symposium (SIEDS) Systems and Information Engineering Design Symposium (SIEDS), 2024. :200-205 May, 2024
Relation: 2024 Systems and Information Engineering Design Symposium (SIEDS)
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4مؤتمر
المصدر: 2024 Systems and Information Engineering Design Symposium (SIEDS) Systems and Information Engineering Design Symposium (SIEDS), 2024. :337-342 May, 2024
Relation: 2024 Systems and Information Engineering Design Symposium (SIEDS)
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5مؤتمر
المؤلفون: Zhafrani, Mohamad Hilmy, Budiardjo, Eko K, Mahatma, Kodrat
المصدر: 2024 2nd International Conference on Software Engineering and Information Technology (ICoSEIT) Software Engineering and Information Technology (ICoSEIT), 2024 2nd International Conference on. :58-63 Feb, 2024
Relation: 2024 2nd International Conference on Software Engineering and Information Technology (ICoSEIT)
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6رسالة جامعية
المؤلفون: Ariño Palacín, María
المساهمون: University/Department: Universitat de Girona. Departament de Física
مرشدي الرسالة: Costa i Balanzat, Josep, Curado Mateus Correia, Nuno André, Cruz Torres, Sylvia Andrea
المصدر: TDX (Tesis Doctorals en Xarxa)
مصطلحات موضوعية: Infusió de resina, Infusión de resina, Vacuum infusion, Moldeig per transferència de resina, Moldeo para transferencia de resina, Resine transfer molding RTM, Compòstis de matriu polimèrica, Compuestos de matriz polimérica, Polymer-matrix composites, Defectes, Defectos, Defects, Millora del procés, Mejora del proceso, Process improvement, Anàlisi microestructural, Análisis microestructural, Microstructural analysis, Disseny del motlle, Diseño del molde, Mold design
وصف الملف: application/pdf
URL الوصول: http://hdl.handle.net/10803/687434
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7مؤتمر
المؤلفون: Strussmann, B. R., Hvam, L.
المصدر: 2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) Industrial Engineering and Engineering Management (IEEM), 2023 IEEE International Conference on. :0198-0202 Dec, 2023
Relation: 2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)
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8مؤتمر
المؤلفون: Abad, K. M., Dantes, M. F., Garcia, A. M., Gonzales, C., Halog, J. M., Madalang, K. B., Santos, M., Navarro, M.M., Palisoc, A.A., Dinglasan, J.M.
المصدر: 2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) Industrial Engineering and Engineering Management (IEEM), 2023 IEEE International Conference on. :1138-1142 Dec, 2023
Relation: 2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)
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9مؤتمر
المؤلفون: Antal, Kristof, Szabo, Zoltan
المصدر: 2023 15th International Conference on Software, Knowledge, Information Management and Applications (SKIMA) Software, Knowledge, Information Management and Applications (SKIMA), 2023 15th International Conference on. :255-260 Dec, 2023
Relation: 2023 15th International Conference on Software, Knowledge, Information Management and Applications (SKIMA)
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10مؤتمر
المؤلفون: Guerra-Garcia, Cesar, Perez-Gonzalez, Hector G., Martinez-Perez, Francisco, Juarez-Ramirez, Reyes, Jimenez, Samantha
المصدر: 2023 11th International Conference in Software Engineering Research and Innovation (CONISOFT) CONISOFT Software Engineering Research and Innovation (CONISOFT), 2023 11th International Conference in. :108-115 Nov, 2023
Relation: 2023 11th International Conference in Software Engineering Research and Innovation (CONISOFT)