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المؤلفون: Shubhada H. Sahasrabudhe, Scott Mokler, Owen Jin, Nilesh Badwe, Pubudu Goonetilleke, Eric Brigham, Kevin Byrd, Satish Parupalli, Sandeep B. Sane, M. Renavikar
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Reliability (semiconductor), Computer science, Soldering, 0103 physical sciences, Process (computing), Mechanical engineering, 01 natural sciences, Temperature measurement, Design for manufacturability
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2bfc9d5842152a69dff95d767963e05a
https://doi.org/10.1109/ectc.2018.00222