المؤلفون: Mooney, J.P., Egan, V., Quinlan, R., Punch, J.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(11):1896-1908 Nov, 2021

المؤلفون: Nico, V., Frizzell, R., Punch, J.

المصدر: IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 25(6):2973-2980 Dec, 2020

المؤلفون: Schacht, R., Punch, J., Merten, E., Rzepka, S., Michel, B.

المصدر: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2015 21st International Workshop on. :1-6 Sep, 2015

Relation: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

المؤلفون: Walsh, Ed J., Breen, Thomas J., Punch, J., Shah, Amip J., Bash, Cullen E.

المصدر: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. :1-7 Jun, 2010

Relation: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Punch, J., Walsh, E., Grimes, R., Jeffers, N., Kearney, D.

المصدر: 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on. :1-4 Apr, 2010

Relation: 2010 11th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Burke, C., Punch, J.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 4(3):516-527 Mar, 2014

المؤلفون: Butler, C., Babu, S., Lundy, R., O'Reilly Meehan, R., Punch, J., Jeffers, N.

المصدر: In Materials Characterization March 2021 173

المؤلفون: Waddell, A.M., Punch, J., Stafford, J., Jeffers, N.

المصدر: 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st. :273-279 Mar, 2015

Relation: 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

المؤلفون: Reid, M., Punch, J., Galkin, T., Vakevainen, K., Stenberg, T., Vilen, M., Pomeroy, M.J., Mihov, M.

المصدر: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :330-334 2005

Relation: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

المؤلفون: Punch, J., Grimes, R., Heaslip, G., Galkin, T., Vakevainen, K., Kyyhkynen, V., Elonen, E.

المصدر: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :398-405 2005

Relation: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems