المؤلفون: WU Zuji, FAN Jiafeng, LI Jingmao, ZHU Dezhi, QU Shengguan, LI Xiaoqiang

المصدر: Cailiao gongcheng, Vol 50, Iss 12, Pp 103-111 (2022)

مصطلحات موضوعية: ti-doped, wc-ni3al, in-situ (ti, w)c, microstructure, mechanical property, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2021.001154; https://doaj.org/toc/1001-4381

URL الوصول: https://doaj.org/article/9e656b8c9a30449f84eb27ebdc6f06dd

المؤلفون: LAI Jiaming, LI Jingmao, ZHU Dezhi, LIANG Liang, QU Shengguan, LI Xiaoqiang

المصدر: Cailiao gongcheng, Vol 50, Iss 11, Pp 73-80 (2022)

مصطلحات موضوعية: wc, mgo, b2o3, sintering mechanism, microstructure evolution, mechanical property, sintering temperature, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2021.000441; https://doaj.org/toc/1001-4381

URL الوصول: https://doaj.org/article/a6a27fc730134369af16cdef3b583cf9

المؤلفون: Zeng, Zhengfeng, Lv, Jiliang, Qu, Shengguan, Shao, Huitu

المصدر: 2023 3rd International Conference on Intelligent Power and Systems (ICIPS) Intelligent Power and Systems (ICIPS), 2023 3rd International Conference on. :245-249 Oct, 2023

Relation: 2023 3rd International Conference on Intelligent Power and Systems (ICIPS)

المؤلفون: Shao, Huitu, Lv, Jiliang, Qu, Shengguan, Ceng, Zhengfeng

المصدر: 2023 3rd International Conference on Intelligent Power and Systems (ICIPS) Intelligent Power and Systems (ICIPS), 2023 3rd International Conference on. :213-217 Oct, 2023

Relation: 2023 3rd International Conference on Intelligent Power and Systems (ICIPS)

المؤلفون: Xu, Aimin, Lv, Jiliang, Qu, Shengguan, Yang, Liang, Yao, Tianwen

المصدر: 2023 3rd Asia-Pacific Conference on Communications Technology and Computer Science (ACCTCS) ACCTCS Communications Technology and Computer Science (ACCTCS), 2023 3rd Asia-Pacific Conference on. :295-298 Feb, 2023

Relation: 2023 3rd Asia-Pacific Conference on Communications Technology and Computer Science (ACCTCS)

المؤلفون: Yang, Liang, Qu, Chenxi, Yin, Peng^{Aff1, IDs00521023083489_cor3}, Lv, Jiliang, Qu, Shengguan^{Aff1, IDs00521023083489_cor5}

المصدر: Neural Computing and Applications. 35(35):24595-24602

المؤلفون: Yao, Tianwen, Lv, Jiliang, Yang, Liang^{Aff1, IDs4223502300335z_cor3}, Xu, Aimin, Qu, Shengguan

المصدر: Journal of Bionic Engineering. 20(4):1613-1625

المؤلفون: Fan, Jiafeng, Li, Xiaoqiang, Jiang, Qi, Pan, Cunliang, Rong, Xincheng, Qu, Shengguan, Yang, Chao, Lv, Yanlong, Hou, Jinbao

المصدر: In Journal of Materials Processing Tech. October 2024 331

المؤلفون: Duan, Chenfeng, Qu, Shengguan, Sun, Pengfei, Li, Xiaoqiang

المصدر: In Surface & Coatings Technology 15 May 2024 483

المؤلفون: Zhu, Dezhi, Chen, Tingting, Jin, Xiaoqiang, Wen, Haiming, Fu, Zhiqiang, Qu, Shengguan

المصدر: In Journal of Materials Research and Technology May-June 2024 30:1009-1019