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1مؤتمر
المؤلفون: Qu Li-gang, Wang Wei, Gong Ya-dong, Wang Wan-shan
المصدر: 2008 3rd IEEE Conference on Industrial Electronics and Applications Industrial Electronics and Applications, 2008. ICIEA 2008. 3rd IEEE Conference on. :1133-1136 Jun, 2008
Relation: 2008 3rd IEEE Conference on Industrial Electronics and Applications (ICIEA)
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2
المؤلفون: Wang Wei, Wang Wan-shan, Qu Li-gang, Gong Ya-dong
المصدر: 2008 3rd IEEE Conference on Industrial Electronics and Applications.
مصطلحات موضوعية: SQL, Engineering, Collaborative software, Product design, computer.internet_protocol, business.industry, Service-oriented architecture, computer.software_genre, Design education, Systems engineering, Software design, Electronic design automation, Web service, business, computer, computer.programming_language
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::244b0ca11bf69112f02328e7595a2dd0
https://doi.org/10.1109/iciea.2008.4582695 -
3دورية
المؤلفون: Qu, Li Gang, Ji, Wei, Wang, Gui He
المصدر: Applied Mechanics and Materials; December 2014, Vol. 709 Issue: 1 p205-209, 5p
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4دورية
المؤلفون: Qu, Li Gang, Chen, Guo Tao, Su, Chang Qing, Xin, Yu Juan
المصدر: Applied Mechanics and Materials; December 2014, Vol. 709 Issue: 1 p451-455, 5p
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5دورية
المؤلفون: Qu, Li Gang, Dong, Zhi Liang, Zhou, Hai Jun
المصدر: Applied Mechanics and Materials; November 2014, Vol. 687 Issue: 1 p743-746, 4p
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6دورية
المؤلفون: Qu, Li Gang, Zhou, Hai Jun, Dong, Zhi Liang
المصدر: Applied Mechanics and Materials; November 2014, Vol. 696 Issue: 1 p287-292, 6p
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7دورية
المؤلفون: Qu, Li Gang, Li, Jian, Su, Dong Dong
المصدر: Applied Mechanics and Materials; December 2012, Vol. 246 Issue: 1 p682-686, 5p
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8دورية
المؤلفون: Qu, Li Gang, Liu, Hai Bin
المصدر: Advanced Materials Research; February 2012, Vol. 476 Issue: 1 p2028-2031, 4p
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9دورية
المؤلفون: Qu, Li Gang, Zheng, Shuang, Han, Xiao Guang
المصدر: Applied Mechanics and Materials; December 2011, Vol. 148 Issue: 1 p1464-1467, 4p
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10دورية
المؤلفون: Qu, Li Gang, Zheng, Shuang, Guo, Hong Jie
المصدر: Advanced Materials Research; February 2011, Vol. 189 Issue: 1 p296-299, 4p