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1دورية أكاديمية
المؤلفون: Yuan Wang, Xingxia Hou, Chengyu Guo, Jiayun Zhang, Xu Wang, Yunbo Xu
المصدر: Journal of Materials Research and Technology, Vol 32, Iss , Pp 2357-2369 (2024)
مصطلحات موضوعية: TBF steel, Pre-quenching process, Hole expansion ratio, Void formation, Microstructure evolution, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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2دورية أكاديمية
المصدر: IEEE Transactions on Systems, Man, and Cybernetics: Systems IEEE Trans. Syst. Man Cybern, Syst. Systems, Man, and Cybernetics: Systems, IEEE Transactions on. 52(8):4912-4924 Aug, 2022
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3مؤتمر
المؤلفون: Zhang, Wen, Wu, Min, Chen, Cong, Du, Sheng, Chen, Luefeng
المصدر: 2021 40th Chinese Control Conference (CCC) Chinese Control Conference (CCC), 2021 40th. :2504-2509 Jul, 2021
Relation: 2021 40th Chinese Control Conference (CCC)
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4دورية أكاديمية
المؤلفون: Deng, YinAff1, Aff2, Wang, Cai-PingAff1, Aff2, Xiao, YangAff1, Aff2, IDs1097302211936x_cor3, Chen, Hui-Long, Deng, JunAff1, Aff2, Du, Yu-XinAff1, Aff2, Bai, Guang-XingAff1, Aff2
المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 148(11):4883-4895
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5دورية أكاديمية
المؤلفون: Jiamin Sun, Thomas Nitschke-Pagel, Klaus Dilger
المصدر: Journal of Materials Research and Technology, Vol 27, Iss , Pp 3936-3954 (2023)
مصطلحات موضوعية: Welding-induced residual stresses, Longitudinal residual stress, Thermal shrinkage process, Phase transformation process, Transverse residual stress, Quenching process, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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6مؤتمر
المصدر: 2019 16th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON), 2019 16th International Conference on. :191-194 Jul, 2019
Relation: 2019 16th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)
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7دورية أكاديمية
المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 29(5):1-4 Aug, 2019
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8
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9دورية أكاديمية
المؤلفون: Bing Wang, Cenxin Fu, Xiaodong Liu, Bingying Xie, David A. Hall
المصدر: Open Ceramics, Vol 13, Iss , Pp 100322- (2023)
مصطلحات موضوعية: Lead-free ferroelectrics, Core-shell microstructure, High energy milling, Quenching process, Clay industries. Ceramics. Glass, TP785-869
وصف الملف: electronic resource
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10دورية أكاديمية
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