المؤلفون: Yuan Wang, Xingxia Hou, Chengyu Guo, Jiayun Zhang, Xu Wang, Yunbo Xu

المصدر: Journal of Materials Research and Technology, Vol 32, Iss , Pp 2357-2369 (2024)

مصطلحات موضوعية: TBF steel, Pre-quenching process, Hole expansion ratio, Void formation, Microstructure evolution, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S223878542401860X; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/edb5ed17daa94ebfb78329f865238130

المؤلفون: Shen, L., Chen, Z., Jiang, Z., He, J., Yang, C., Gui, W.

المصدر: IEEE Transactions on Systems, Man, and Cybernetics: Systems IEEE Trans. Syst. Man Cybern, Syst. Systems, Man, and Cybernetics: Systems, IEEE Transactions on. 52(8):4912-4924 Aug, 2022

المؤلفون: Zhang, Wen, Wu, Min, Chen, Cong, Du, Sheng, Chen, Luefeng

المصدر: 2021 40th Chinese Control Conference (CCC) Chinese Control Conference (CCC), 2021 40th. :2504-2509 Jul, 2021

Relation: 2021 40th Chinese Control Conference (CCC)

المؤلفون: Deng, Yin^{Aff1, Aff2}, Wang, Cai-Ping^{Aff1, Aff2}, Xiao, Yang^{Aff1, Aff2, IDs1097302211936x_cor3}, Chen, Hui-Long, Deng, Jun^{Aff1, Aff2}, Du, Yu-Xin^{Aff1, Aff2}, Bai, Guang-Xing^{Aff1, Aff2}

المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 148(11):4883-4895

المؤلفون: Jiamin Sun, Thomas Nitschke-Pagel, Klaus Dilger

المصدر: Journal of Materials Research and Technology, Vol 27, Iss , Pp 3936-3954 (2023)

مصطلحات موضوعية: Welding-induced residual stresses, Longitudinal residual stress, Thermal shrinkage process, Phase transformation process, Transverse residual stress, Quenching process, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423027011; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/017037d7f8b24e3592004c3f1109d7c6

المؤلفون: Jumpar-ngern, Jitrin, Sompong, Khanisorn, Wasapinyokul, Kamol

المصدر: 2019 16th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON), 2019 16th International Conference on. :191-194 Jul, 2019

Relation: 2019 16th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)

المؤلفون: Zhao, Y., Li, P.Y., Ke, C., Yu, Z., Pan, X.F., Cheng, C.H., Yan, G., Zhang, Y., Feng, Y.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 29(5):1-4 Aug, 2019

المؤلفون: Zhao, Y., Yang, C., Xia, L., Yu, Z., Li, P., Yang, X., Ke, C., Pan, X., Yan, G., Zhang, Y., Feng, Y.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 29(2):1-4 Mar, 2019

المؤلفون: Bing Wang, Cenxin Fu, Xiaodong Liu, Bingying Xie, David A. Hall

المصدر: Open Ceramics, Vol 13, Iss , Pp 100322- (2023)

مصطلحات موضوعية: Lead-free ferroelectrics, Core-shell microstructure, High energy milling, Quenching process, Clay industries. Ceramics. Glass, TP785-869

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2666539522001055; https://doaj.org/toc/2666-5395

URL الوصول: https://doaj.org/article/71fc2214582e467fb33dd29a15edacaa

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