-
1
المؤلفون: B.D. Potteiger, John Michael DeLucca, R.L. Shook, Ahmed Amin, Frank A. Baiocchi, John William Osenbach
المصدر: IEEE Transactions on Electronics Packaging Manufacturing. 30:23-35
مصطلحات موضوعية: Crystallography, Materials science, Electron diffraction, Whisker, Scanning electron microscope, Nucleation, Energy-dispersive X-ray spectroscopy, Grain boundary, Electrical and Electronic Engineering, Composite material, Microstructure, Industrial and Manufacturing Engineering, Corrosion
-
2
المؤلفون: P. Suratkar, Brian T. Vaccaro, R.L. Shook, B.D. Potteiger, P. Ruengsinsub, Ahmed Amin, K.N. Hooghan, John William Osenbach
المصدر: IEEE Transactions on Electronics Packaging Manufacturing. 28:36-62
مصطلحات موضوعية: Reflow soldering, Materials science, Whisker, Annealing (metallurgy), Whiskers, Soldering, Nucleation, Biasing, Temperature cycling, Electrical and Electronic Engineering, Composite material, Industrial and Manufacturing Engineering
-
3
المؤلفون: R.L. Shook, D.B. Steele, T.R. Conrad, V.S. Sastry
المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C. 19:110-118
مصطلحات موضوعية: Surface-mount technology, Engineering, Moisture, business.industry, General Engineering, Electrical engineering, Mechanical engineering, Integrated circuit, law.invention, law, Derating, Ball grid array, Factory (object-oriented programming), Relative humidity, Integrated circuit packaging, business
-
4
المؤلفون: R.L. Shook, P. Ruengsinsub, Ahmed Amin, B.D. Potteiger, Brian T. Vaccaro, John William Osenbach
المصدر: 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
مصطلحات موضوعية: Lead frame, Reflow soldering, Materials science, chemistry, Whisker, Annealing (metallurgy), Whiskers, Metallurgy, Electronic packaging, chemistry.chemical_element, Tin, Electroplating
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8ef480124713487c53d392366c433500
https://doi.org/10.1109/ectc.2004.1320283 -
5
المؤلفون: C. Horvath, A. Dairo, R.L. Shook, J.J. Gilbert, Brian T. Vaccaro, D.L. Gerlach, D.L. Crouthamel, G.J. Libricz, E. Thomas
المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings..
مصطلحات موضوعية: Materials science, Moisture, Ball grid array, Mold, Thermal, Delamination, Electronic packaging, medicine, Solder ball, Composite material, medicine.disease_cause, Lead (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::25c64054c26a69fb3ccb825ca97f7d15
https://doi.org/10.1109/ectc.2003.1216551 -
6
المؤلفون: J.P. Goodelle, R.L. Shook
المصدر: 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
مصطلحات موضوعية: Surface-mount technology, Materials science, Waste management, Moisture, business.industry, Survivability, Humidity, Moisture diffusion, Industrial and Manufacturing Engineering, Containment, Sensitivity (control systems), Integrated circuit packaging, Electrical and Electronic Engineering, Process engineering, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bc7a00987540ffc4d0e4c55f4774a2f1
https://doi.org/10.1109/ectc.1999.776275 -
7
المؤلفون: T.R. Conrad, R.L. Shook
المصدر: 1994 Proceedings. 44th Electronic Components and Technology Conference.
مصطلحات موضوعية: Surface-mount technology, Reflow soldering, Materials science, Moisture, Thermal resistance, Delamination, Integrated circuit packaging, Temperature cycling, Composite material, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3bb3ee17036fc00df77011ce0dea3dab
https://doi.org/10.1109/ectc.1994.367543 -
8Influence of preheat and maximum temperature of the solder-reflow profile on moisture sensitive IC's
المؤلفون: V.S. Sastry, R.L. Shook
المصدر: 1997 Proceedings 47th Electronic Components and Technology Conference.
مصطلحات موضوعية: Surface-mount technology, Absorption (acoustics), Reflow soldering, Materials science, Moisture, Soldering, Integrated circuit packaging, Environmental exposure, Composite material, Temperature measurement
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3fdd1349ff313fb0e2994929958ad460
https://doi.org/10.1109/ectc.1997.606299 -
9
المؤلفون: R.L. Shook, T.R. Conrad, V.S. Sastry, D.B. Steele
المصدر: 1995 Proceedings. 45th Electronic Components and Technology Conference.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a06e74faf5d90e430128dec76f8e2598
https://doi.org/10.1109/ectc.1995.515319 -
10
المؤلفون: R.L. Shook, C.M. Yang
المصدر: 1995 Proceedings. 45th Electronic Components and Technology Conference.
مصطلحات موضوعية: Surface-mount technology, Cracking, Materials science, law, Soldering, Compatibility (mechanics), Integrated circuit, Integrated circuit packaging, Composite material, Wave soldering, Finite element method, law.invention
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c19b06242354e821a574255c17f67728
https://doi.org/10.1109/ectc.1995.514364