المؤلفون: Herd, J., Carlson, D., Duffy, S., Weber, M., Brigham, G., Rachlin, M., Cursio, D., Liss, C., Weigand, C.

المصدر: 2010 IEEE Radar Conference Radar Conference, 2010 IEEE. :945-948 May, 2010

Relation: 2010 IEEE International Radar Conference

المؤلفون: Chien, D.H., Chin C. Lee, Rachlin, M., Peake, A., Kole, T.

المصدر: Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings Semiconductor thermal measurement and management Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE. :89-96 1996

Relation: Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings

المؤلفون: Wen-Tang Chen, An-Yu Kuo, Rachlin, M., Peake, A., Lee, C.C., Chien, D.H.

المصدر: InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V Thermal phenomena in electronic systems Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on. :233-238 1996

Relation: InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V

المؤلفون: Riad, S.M., Wansheng Su, Salama, I., Elshabini, A., Rachlin, M.

المصدر: Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on. :129 1998

Relation: Proceedings 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

المؤلفون: Raid, S.M., Su, W., Salama, I., Elshabini-Riad, A., Rachlin, M., Baker, W., Perdue, J.

المصدر: Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Advanced packaging materials - processes, properties and interfaces Advanced Packaging Materials. Proceedings., 3rd International Symposium on. :147 1997

Relation: Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

المؤلفون: Wallace, P.W., Bayruns, J., Scheinberg, N., Rachlin, M., Krautter, H.

المصدر: 10th Annual IEEE (GaAs IC) Symposium, Gallium Arsenide Integrated Circuit. Technical Digest 1988. Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1988. Technical Digest 1988., 10th Annual IEEE. :281-284 1988

Relation: 10th Annual IEEE (GaAs IC) Symposium, Gallium Arsenide Integrated Circuit. Technical Digest 1988.

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