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1دورية أكاديمية
المؤلفون: Raj Mohan R, Venkatraman R, Raghuraman S, Manoj Kumar P, Rajneesh Sharma, null Ankit, Atul Sarojwal, Rajkumar S
المصدر: Advances in Materials Science and Engineering, Vol 2022 (2022)
مصطلحات موضوعية: Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
Relation: https://doaj.org/toc/1687-8442
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2مؤتمر
المؤلفون: Ali, Irfan, Jamaluddin, Mohd Haizal, Kamarudin, Muhammad Ramlee, Gaya, Abinash, Raghuraman, S, Dahri, Muhammad Hashim
المصدر: 2018 IEEE International RF and Microwave Conference (RFM) RF and Microwave Conference (RFM), 2018 IEEE International. :250-253 Dec, 2018
Relation: 2018 IEEE International RF and Microwave Conference (RFM)
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3دورية أكاديمية
المؤلفون: Bhardwaj, S., Raghuraman, S., Acharyya, A.
المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 27(5):1124-1137 May, 2019
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4دورية أكاديمية
المؤلفون: Rakesh, S.Aff1, IDs1336902206979z_cor1, Raghuraman, S., Venkatraman, R.
المصدر: Arabian Journal for Science and Engineering. 48(3):2715-2735
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5دورية أكاديمية
المؤلفون: Raj Mohan, R.Aff1, IDs11837022054284_cor1, Venkatraman, R., Raghuraman, S.
المصدر: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). 75(1):155-166
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6مؤتمر
المؤلفون: Thennarasu, R., Thiruppathi, K., Raghuraman, S.
المصدر: 2016 International Conference on Robotics: Current Trends and Future Challenges (RCTFC) Robotics: Current Trends and Future Challenges (RCTFC), International Conference on. :1-4 2016
Relation: 2016 International Conference on Robotics: Current Trends and Future Challenges (RCTFC)
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7دورية أكاديمية
المؤلفون: Rajeshshyam, R.Aff1, IDs1336902105908w_cor1, Venkatraman, R., Raghuraman, S.
المصدر: Arabian Journal for Science and Engineering. 47(7):8009-8030
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8دورية أكاديمية
المؤلفون: Peddavarapu, SreehariAff1, IDs13369021062298_cor1, Raghuraman, S.
المصدر: Arabian Journal for Science and Engineering. 47(7):8385-8397
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9دورية أكاديمية
المؤلفون: Adapa, B., Biswas, D., Bhardwaj, S., Raghuraman, S., Acharyya, A., Maharatna, K.
المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 25(4):1568-1572 Apr, 2017
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10كتاب إلكتروني
المؤلفون: Raj Mohan, R.Aff11, Venkatraman, R.Aff11, Raghuraman, S.Aff11, Sunil Kumar, P.Aff11, Yokesh Kumar, S.Aff11
المساهمون: Cavas-Martínez, Francisco, Series EditorAff1, Chaari, Fakher, Series EditorAff2, Gherardini, Francesco, Series EditorAff3, Haddar, Mohamed, Series EditorAff4, Ivanov, Vitalii, Series EditorAff5, Kwon, Young W., Series EditorAff6, Trojanowska, Justyna, Series EditorAff7, Ganippa, Lionel, editorAff8, Karthikeyan, R., editorAff9, Muralidharan, V., editorAff10
المصدر: Advances in Design and Thermal Systems : Select Proceedings of ETDMMT 2020. :283-289