يعرض 1 - 10 نتائج من 198 نتيجة بحث عن '"Rahim, E."', وقت الاستعلام: 1.07s تنقيح النتائج
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    كتاب إلكتروني

    المؤلفون: Talib, N.Aff7, Nasir, R. M.Aff8, Rahim, E. A.Aff7, Lee, W. K.Aff7, Abdullah, H.Aff7, Saleh, A.Aff9

    المساهمون: Jawaid, Mohammad, Series EditorAff1, Hameed Sultan, Mohamed Thariq, editorAff2, Mohd Jamir, Mohd Ridzuan, editorAff3, Abdul Majid, Mohd Shukry, editorAff4, Azmi, Azwan Iskandar, editorAff5, Saba, Naheed, editorAff6

    المصدر: Tribological Applications of Composite Materials. :331-345

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    كتاب إلكتروني

    المؤلفون: Ikhwan, S. T. T.Aff14, Yusuf, N. K.Aff14, Lajis, M. A.Aff14, Rahim, E. A.Aff15

    المساهمون: Cavas-Martínez, Francisco, Series EditorAff1, Chaari, Fakher, Series EditorAff2, Gherardini, Francesco, Series EditorAff3, Haddar, Mohamed, Series EditorAff4, Ivanov, Vitalii, Series EditorAff5, Kwon, Young W., Series EditorAff6, Trojanowska, Justyna, Series EditorAff7, Osman Zahid, Muhammed Nafis, editorAff8, Abdul Sani, Amiril Sahab, editorAff9, Mohamad Yasin, Mohamad Rusydi, editorAff10, Ismail, Zulhelmi, editorAff11, Che Lah, Nurul Akmal, editorAff12, Mohd Turan, Faiz, editorAff13

    المصدر: Recent Trends in Manufacturing and Materials Towards Industry 4.0 : Selected Articles from iM3F 2020, Malaysia. :299-310

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    كتاب إلكتروني

    المؤلفون: Rafai, N. H.Aff14, Kamdani, K.Aff14, Ibrahim, M. R.Aff14, Rahim, E. A.Aff14, Sazali, M. N.Aff15, Wong, C. K.Aff15, Chong, Y. L.Aff15

    المساهمون: Cavas-Martínez, Francisco, Series EditorAff1, Chaari, Fakher, Series EditorAff2, Gherardini, Francesco, Series EditorAff3, Haddar, Mohamed, Series EditorAff4, Ivanov, Vitalii, Series EditorAff5, Kwon, Young W., Series EditorAff6, Trojanowska, Justyna, Series EditorAff7, Osman Zahid, Muhammed Nafis, editorAff8, Abdul Sani, Amiril Sahab, editorAff9, Mohamad Yasin, Mohamad Rusydi, editorAff10, Ismail, Zulhelmi, editorAff11, Che Lah, Nurul Akmal, editorAff12, Mohd Turan, Faiz, editorAff13

    المصدر: Recent Trends in Manufacturing and Materials Towards Industry 4.0 : Selected Articles from iM3F 2020, Malaysia. :203-208

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    دورية أكاديمية

    المؤلفون: Kim, D.-W., Rahim, E., Bar-Cohen, A., Han, B.

    المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 33(4):698-712 Dec, 2010

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    دورية أكاديمية
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    مؤتمر

    المصدر: 2009 11th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. :119-130 Dec, 2009

    Relation: 2009 11th Electronics Packaging Technology Conference (EPTC)

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    مؤتمر

    المصدر: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on. :1-2 2006

    Relation: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

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