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المؤلفون: KwangSeok Oh, Rajen Dias, Joon-Young Park, Devarajan Balaraman, Tomio Shiraiwa, Michael G. Kelly, Hideaki Shoji
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Computer science, business.industry, Automotive industry, 02 engineering and technology, Temperature cycling, 021001 nanoscience & nanotechnology, 01 natural sciences, Automotive electronics, Automotive engineering, Die (integrated circuit), Reliability (semiconductor), Operating temperature, Ball grid array, 0103 physical sciences, 0210 nano-technology, business, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fb4243d25c0833315b98b4cf57ebf944
https://doi.org/10.1109/ectc.2019.00032 -
2Methodology and Challenges in Characterization of 3D Package Interconnection Materials and Processes
المؤلفون: Rajen Dias, Deepak Goyal
المصدر: Metrology and Diagnostic Techniques for Nanoelectronics
مصطلحات موضوعية: Interconnection, Materials science, Electronic engineering, Systems engineering, Characterization (materials science)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ce55ebba14a0065e7021ac464550c670
https://doi.org/10.1201/9781315185385-26 -
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المؤلفون: Rajen Dias, Yan Li, J. S. Moore, Balu Pathangey, Deepak Goyal
المصدر: IEEE Transactions on Device and Materials Reliability. 12:494-500
مصطلحات موضوعية: Surface-mount technology, Interconnection, Void (astronomy), Reflow soldering, Materials science, Bubble, Soldering, Metallurgy, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Lead (electronics), Joint (geology), Electronic, Optical and Magnetic Materials
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المؤلفون: Liang Hu, Balu Pathangey, Yan Li, Rajen Dias, M.M. Hossain, Luhua Xu, Pilin Liu, Deepak Goyal, Mario Pacheco
المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Void (astronomy), Materials science, Miniaturization, Electronic engineering, Electronics, Tomography, Activation energy, Electrolyte, Composite material, Kinetic energy, Current density
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f2250566c53d4449a75b31ff00a35506
https://doi.org/10.1109/ectc.2015.7159628 -
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المؤلفون: Shriram Ramanathan, Yongmei Liu, Rajen Dias, Evan Pickett, Patrick Morrow, Chuan Hu
المصدر: Microelectronic Engineering. 82:84-91
مصطلحات موضوعية: Materials science, business.industry, Wafer bonding, Electronic packaging, Low-k dielectric, Acoustic microscopy, Integrated circuit, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Optics, law, Optoelectronics, Wafer, Electrical and Electronic Engineering, Acoustic impedance, business, Flip chip
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المؤلفون: Sudarshan Rangaraj, Kristopher Frutschy, Rajen Dias
المصدر: IEEE Transactions on Device and Materials Reliability. 4:153-162
مصطلحات موضوعية: Interconnection, Materials science, Metallurgy, Thermal expansion, Die (integrated circuit), Electronic, Optical and Magnetic Materials, Stress (mechanics), Printed circuit board, Residual stress, Soldering, Integrated circuit packaging, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality
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المؤلفون: Rajen Dias
المصدر: IEEE Transactions on Device and Materials Reliability. 3:179-183
مصطلحات موضوعية: Materials science, business.industry, Electronic packaging, Acoustic microscopy, Laser, Electronic, Optical and Magnetic Materials, law.invention, law, Heat transfer, Thermography, Electronic engineering, Optoelectronics, Wafer, Spallation, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Image resolution
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المؤلفون: Thomas M. Moore, Gay Samuelson, Cheryl D. Hartfield, Rajen Dias, Deepak Goyal, Shalabh Tandon
المصدر: EDFA Technical Articles. 3:15-19
مصطلحات موضوعية: Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::82bc5dbccce77da8a3d83829f904dc8a
https://doi.org/10.31399/asm.edfa.2001-4.p015 -
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المؤلفون: Gang Li, Rajen Dias, Yan Li, Liang Hu, Deepak Goyal
المصدر: International Symposium for Testing and Failure Analysis.
مصطلحات موضوعية: Materials science, business.industry, Analytical chemistry, Mode (statistics), Optoelectronics, Microelectronics, High resolution, business, Scanning acoustic microscope
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::616b6fdd4f4450ac08cdebe3999355d1
https://doi.org/10.31399/asm.cp.istfa2013p0468 -
10
المؤلفون: Mario Pacheco, Zhiyong Wang, Rajen Dias, Vladimir Talanov, Zhiguo Qian, Mayue Xie
المصدر: International Symposium for Testing and Failure Analysis.
مصطلحات موضوعية: Engineering, business.industry, Integrated circuit, Semiconductor device, Space (mathematics), Fault detection and isolation, law.invention, Domain (software engineering), High resistance, law, Electronic engineering, Isolation (database systems), business, Reflectometry
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::01dff10cff2e60bba752006166a1c497
https://doi.org/10.31399/asm.cp.istfa2012p0011