المؤلفون: Rajkumarsingh, Bhimsen, Luchmun, Maneesh

المصدر: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2023 IEEE Electrical Design of. :1-3 Dec, 2023

Relation: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

المؤلفون: Loderchand, Baboo Sivrajsingh, Ah King, Robert T. F., Rajkumarsingh, Bhimsen

المصدر: 2022 4th International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM) Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM), 2022 4th International Conference on. :1-7 Nov, 2022

Relation: 2022 4th International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM)

المؤلفون: Rajkumarsingh, Bhimsen, Edoo, Muhammad Husayn

المصدر: 2022 4th International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM) Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM), 2022 4th International Conference on. :1-7 Nov, 2022

Relation: 2022 4th International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM)

المؤلفون: Rajkumarsingh, Bhimsen, Edoo, Muhammad Husayn

المصدر: 2022 4th International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM) Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM), 2022 4th International Conference on. :1-7 Nov, 2022

Relation: 2022 4th International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM)

المؤلفون: Ah King, Robert T. F., Rajkumarsingh, Bhimsen, Gopee, Yashtir

المصدر: 2022 4th International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM) Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM), 2022 4th International Conference on. :1-10 Nov, 2022

Relation: 2022 4th International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM)

المؤلفون: Devi Mowlassee, Vidushee, Rajkumarsingh, Bhimsen

المصدر: 2020 3rd International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM) Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM), 2020 3rd International Conference on. :79-86 Nov, 2020

Relation: 2020 3rd International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM)

المؤلفون: Rajkumarsingh, Bhimsen, Prayagsing, Keshav

المصدر: 2020 3rd International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM) Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM), 2020 3rd International Conference on. :94-99 Nov, 2020

Relation: 2020 3rd International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM)

المؤلفون: Yuloganathen, Candassamy, Rajkumarsingh, Bhimsen

المصدر: 2020 3rd International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM) Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM), 2020 3rd International Conference on. :87-93 Nov, 2020

Relation: 2020 3rd International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM)

المؤلفون: Rajkumarsingh, Bhimsen^Aff39, Sokappadu, Bhargava N.^Aff39

المساهمون: Angrisani, Leopoldo, Series Editor^Aff1, Arteaga, Marco, Series Editor^Aff2, Panigrahi, Bijaya Ketan, Series Editor^Aff3, Chakraborty, Samarjit, Series Editor^Aff4, Chen, Jiming, Series Editor^Aff5, Chen, Shanben, Series Editor^Aff6, Chen, Tan Kay, Series Editor^Aff7, Dillmann, Rüdiger, Series Editor^Aff8, Duan, Haibin, Series Editor^Aff9, Ferrari, Gianluigi, Series Editor^Aff10, Ferre, Manuel, Series Editor^Aff11, Hirche, Sandra, Series Editor^Aff12, Jabbari, Faryar, Series Editor^Aff13, Jia, Limin, Series Editor^Aff14, Kacprzyk, Janusz, Series Editor^Aff15, Khamis, Alaa, Series Editor^Aff16, Kroeger, Torsten, Series Editor^Aff17, Liang, Qilian, Series Editor^Aff18, Martin, Ferran, Series Editor^Aff19, Ming, Tan Cher, Series Editor^Aff20, Minker, Wolfgang, Series Editor^Aff21, Misra, Pradeep, Series Editor^Aff22, Möller, Sebastian, Series Editor^Aff23, Mukhopadhyay, Subhas, Series Editor^Aff24, Ning, Cun-Zheng, Series Editor^Aff25, Nishida, Toyoaki, Series Editor^Aff26, Pascucci, Federica, Series Editor^Aff27, Qin, Yong, Series Editor^Aff28, Seng, Gan Woon, Series Editor^Aff29, Speidel, Joachim, Series Editor^Aff30, Veiga, Germano, Series Editor^Aff31, Wu, Haitao, Series Editor^Aff32, Zhang, Junjie James, Series Editor^Aff33, Fleming, Peter, editor^Aff34, Lacquet, Beatrys Margaretha, editor^Aff35, Sanei, Saeid, editor^Aff36, Deb, Kalyanmoy, editor^Aff37, Jakobsson, Andreas, editor^Aff38

المصدر: Smart and Sustainable Engineering for Next Generation Applications : Proceeding of the Second International Conference on Emerging Trends in Electrical, Electronic and Communications Engineering (ELECOM 2018), November 28–30, 2018, Mauritius. 561:180-191

المؤلفون: Rajkumarsingh, Bhimsen^Aff5, Goolaup, Sarjoosing^Aff6

المساهمون: Fleming, Peter, editor^Aff1, Vyas, Nalinaksh, editor^Aff2, Sanei, Saeid, editor^Aff3, Deb, Kalyanmoy, editor^Aff4

المصدر: Emerging Trends in Electrical, Electronic and Communications Engineering : Proceedings of the First International Conference on Electrical, Electronic and Communications Engineering (ELECOM 2016), Bagatelle, Mauritius, November 25 -27, 2016. 416:94-106