المؤلفون: Lee, Tae-Kyu, Park, Yujin, Ramakrishna, Gnyaneshwar, Gothe, Pushkar, Lee, Young-Woo, Kim, Hui-Joong, Lee, Seul-Gi, Kim, Choong-Un

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1439-1444 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Lee, Tae-Kyu, Park, Yujin, Ramakrishna, Gnyaneshwar, Nam, Jonghyun, Yoon, Daljin, Roh, Heera

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1124-1130 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Chang, Graver, Chen, Mark, Lee, Dem, Lee, Jeffrey, Ramakrishna, Gnyaneshwar, Oliver, Jennifer, Chou, Tacio

المصدر: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International. :96-100 Oct, 2013

Relation: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Bansal, Anurag, Ramakrishna, Gnyaneshwar, Liu, Kuo-Chuan

المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1255-1262 May, 2011

Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

المؤلفون: Ramakrishna, Gnyaneshwar, Nandagopal, Bala, Dick, Tim, Burton, Anthony, Higdon, Reggie, Anvari, Mike, Hu, Mason, Teng, Sue, Xue, Jie

المصدر: 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :1313-1319 Jun, 2007

Relation: 2007 57th Electronic Components and Technology Conference

المؤلفون: Pucha, Raghuram V, Ramakrishna, Gnyaneshwar, Mahalingam, Saketh, Sitaraman, Suresh K

المصدر: In International Journal of Fatigue September 2004 26(9):947-957

المؤلفون: Tseng, Chien-Fu, Lee, Tae-Kyu, Ramakrishna, Gnyaneshwar, Liu, Kuo-Chuan, Duh, Jenq-Gong

المصدر: In Materials Letters 2011 65(21):3216-3218

المؤلفون: Komarakshi R. Balakrishnan, Ramakrishna Gnyaneshwar, Ramarathnam Krishna Kumar

المصدر: IndraStra Global.

مصطلحات موضوعية: Pulmonary and Respiratory Medicine, Aortic valve, geometry, aorta valve, heart dilatation, heart cycle, Finite Element Analysis, Shell (structure), aorta sinus, surgical technique, Stress (mechanics), stress, Medicine, Humans, Biomechanics, Computer Simulation, Aorta, Cardiac cycle, business.industry, Linear elasticity, aorta root, Heart, Anatomy, Mechanics, Finite element method, Biomechanical Phenomena, medicine.anatomical_structure, priority journal, Free surface, Aortic Valve, cardiovascular system, Dilation (morphology), Surgery, Cardiology and Cardiovascular Medicine, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dfc940ba5a99a22c20608b7368da0ba3

المؤلفون: Pucha, Raghuram V., Hegde, Shashikant, Damani, Manoj, Tunga, Krishna, Perkins, Andy, Mahalingam, Sakethraman, Ramakrishna, Gnyaneshwar, Lo, George C., Klein, Kevin, Ahmad, Jamil, Sitaraman, Suresh K.

المصدر: IEEE Transactions on Advanced Packaging; May2004, Vol. 27 Issue 2, p438-452, 15p

مصطلحات موضوعية: MIXED signal circuits, CONVERGENCE (Telecommunication), INTEGRATED circuits, RADIO frequency, ELECTRONIC packaging, ELECTRONIC circuits